Extreme Ultraviolet Lithography (EUVL) Market Share Driven by Wafer Miniaturization and Foundry Expansion | Valuates Reports

Extreme Ultraviolet Lithography (EUL) Market Size

The global market for Extreme Ultraviolet Lithography (EUL) was valued at US$ 7267 million in the year 2024 and is projected to reach a revised size of US$ 28660 million by 2031, growing at a CAGR of 22.0% during the forecast period.

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The Extreme Ultraviolet Lithography (EUVL) market continues to expand rapidly, driven by the global shift toward advanced semiconductor manufacturing and the rising need for smaller, more powerful integrated circuits. As chip designs reach the limits of traditional photolithography, EUVL technology has become indispensable for achieving higher transistor density and performance efficiency. The market's strong growth trajectory is underpinned by increasing wafer-processing capabilities, rising adoption of advanced nodes, and the surging demand for miniaturized electronic devices across consumer electronics, automotive, and computing sectors. These market trends are redefining the market size and positioning EUVL as the cornerstone of next-generation chip fabrication.

By type, the light source segment commands the largest market share due to its central role in determining the precision and efficiency of lithographic exposure. Advances in laser-produced plasma sources are enhancing throughput and stability, improving overall system performance. The mirrors segment, essential for reflecting EUV light within vacuum chambers, follows as a critical component ensuring high-resolution imaging. Masks and other supporting parts continue to evolve through innovation in defect control and materials engineering, helping maintain process consistency and pattern fidelity across complex chip architectures.

In terms of application, foundries lead the market, driven by aggressive expansion plans and high-volume manufacturing of advanced logic chips. Companies such as TSMC are at the forefront, investing heavily in EUV lithography to extend their process technology leadership. Integrated Device Manufacturers (IDMs) are also increasing EUVL deployment to boost production efficiency and accelerate next-generation chip development. These applications are propelling market growth as global chipmakers strive to meet rising demand for high-performance computing, 5G, and artificial intelligence.

From a company perspective, ASML dominates the global landscape with the largest market share, supplying complete EUV systems and driving continuous technological innovation. Zeiss remains a key strategic partner providing advanced optical components, while Canon and Nikon strengthen their competitive presence through R&D in alternative lithography technologies. NTT Advanced Technology supports the ecosystem through precision materials and metrology innovations. Together, these companies are shaping market trends by enabling higher productivity, improved system reliability, and closer collaboration across the semiconductor supply chain.

Regionally, the Asia-Pacific (APAC) region leads the EUVL market, supported by extensive wafer fabrication capacity and government-backed initiatives to expand semiconductor manufacturing. Countries such as China, Japan, South Korea, and Taiwan are major centers of EUV adoption, with Taiwan's foundries-particularly TSMC-accounting for a substantial share of production activity. North America and Europe follow with robust R&D ecosystems and strategic investments aimed at supply chain diversification. The market forecast points to sustained expansion, fueled by ongoing innovation, capacity scaling, and the growing need for high-density chip production, making EUVL a critical enabler of the semiconductor industry's future evolution.

By Type
• Light Source
• Mirror
• Mask

By Application
• Integrated Device Manufacturers (IDM)
• Foundry

Key Companies
ASML, Nikon, Canon, Carl Zeiss, Toppan Printing, NTT Advanced Technology, Intel, Samsung, SK Hynix, Toshiba, TSMC, Globalfoundries

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This release was published on openPR.