Through Silicon Via (TSV) Equipment Market Size, Revenue Share, Insights & Future Outlook

Through Silicon Via (TSV) Equipment Market

Through silicon via (TSV) is a vertical interconnection technology that penetrates silicon wafers or chips. It achieves fully perforated vertical electrical connections between chips, between chips and wafers, and between wafers by drilling tiny holes (via) on silicon wafers and filling them with conductive materials (such as copper, polysilicon, tungsten, etc.). The basic structure of TSV includes two metal shells (i.e., upper metal and lower metal) and a filling spacer layer. The holes of TSV pass through the silicon substrate to connect the upper and lower metal electrodes together. TSV technology is widely used in different high-speed applications, such as data centers, servers, graphics processing units (GPUs), artificial intelligence (AI)-based processors, and a variety of wireless communication devices. Through silicon via (TSV) equipment is an important technology in the field of semiconductor packaging. Its emergence and application have greatly promoted the performance improvement and integration increase of semiconductor devices.

The global Through Silicon Via (TSV) Equipment market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.

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The global through-silicon via (TSV) market is expected to continue to grow. As one of the important markets, China's through-silicon via (TSV) market is also expanding. With the advancement of technology and the expansion of application areas, the growth of the Chinese market is expected to remain strong in the next few years. The through-silicon via (TSV) equipment market can be subdivided into middle through-via, first through-via and last through-via according to product type. Different types of products differ in performance, application areas and market share. From the perspective of application areas, through-silicon via (TSV) equipment is mainly used in 3D Nand, Dram, Flash, Logic and other fields. With the continuous advancement of technology and the expansion of application areas, more application scenarios are expected to appear in the future.

By Type
• Middle Through Hole
• First Through Hole
• Later Through Hole

By Application
• Semiconductor
• Consumer Electronics
• Automotive Electronics
• Aerospace

Key Companies
Yingsheng Electronic Technology, ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing, Intel Corporation, China Resources Microelectronics, Jiangsu Changdian Technology

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This release was published on openPR.