Fan-Out Wafer Level Packaging Market Size, Revenue Share, Insights & Future Outlook

Fan-Out Wafer Level Packaging Market Size

In 2024, the global market size of Fan-Out Wafer Level Packaging was estimated to be worth US$ 1970 million and is forecast to reach approximately US$ 6983 million by 2031 with a CAGR of 20.1% during the forecast period 2025-2031.

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The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts.

The industry"s leading producers are TSMC, ASE Technology Holding Co., and JCET Group, which accounted for 44.97%, 16.03% and 11.81% of revenue in 2019, respectively.

By Type
• High Density Fan-Out Package
• Core Fan-Out Package

By Application
• CMOS Image Sensor
• A Wireless Connection
• Logic and Memory Integrated Circuits
• Mems and Sensors
• Analog and Hybrid Integrated Circuits

Key Companies
TSMC, ASE Technology Holding Co., JCET Group, Amkor Technology, Siliconware Technology (SuZhou) Co., Nepes

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