Semiconductor Mask Inspection Device Market Size Report 2025

Global Info Research's report is a detailed and comprehensive analysis for global Semiconductor Mask Inspection Device market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the Semiconductor Mask Inspection Device market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

According to our (Global Info Research) latest study, the global Semiconductor Mask Inspection Device market size was valued at US$ 1830 million in 2024 and is forecast to a readjusted size of USD 3458 million by 2031 with a CAGR of 9.2% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
A mask is an original master for transferring IC patterns to the semiconductor wafers. Defects during lithography that exceed expected size must be identified and corrected. Semiconductor devices are manufactured using photomasks, which serve as the source of original patterns for integrated circuits. Semiconductor Mask Inspection Device looks for pattern defects and foreign matter on the surface of the mask. This equipment is used in semiconductor plants to inspect masks received from suppliers, such as mask shops, and to conduct regular inspections of masks during the device production process. Mask inspection equipment is also used by mask shops to inspect masks before shipment to device makers. A major reason why mask inspection equipment is required is that masks often develop a solid growing foreign matter (haze) on their top surface and back side. Masks therefore must be inspected for such impurities before continuing with the semiconductor manufacturing process. The adoption of ArF lithography has increased the level of irradiation light energy. During exposure, gaseous impurities, such as organic substances and ammonia, are present in trace amounts on the mask. Irradiation by a short wavelength laser decomposes these gaseous substances and induces bonding, which often leads to the emergence of a solid growing foreign matter (haze) on the top surface and back side of the mask. Although this haze is microscopic, usually only several tens of nanometers, if it grows it will be transferred to the wafer during the lithography process, resulting in a defective semiconductor device. Defects that are detected after patterns are written on masks include protrusions from the pattern, cracks in the pattern, dirt or dust on the transparent portion, and transparent pinholes in the portion of the pattern that is shielded from light.
Market Growth Drivers
Semiconductor Industry Expansion: Accelerated construction of new wafer fabs globally (28 new plants in 2023, including 20 in mainland China), driving the CAGR of photomask demand to 11.77%.
Localization Acceleration: Current domestic production rate of high-end photomasks remains below 20%, with policy support speeding up local capacity expansion (e.g., SPPI's 130-28nm production line to commence in 2025).
Technology Evolution: EUV lithography and advanced packaging (Chiplet/3D IC) require defect density at nanoscale, forcing inspection equipment upgrades.
Technology Trends
High-Resolution Inspection: Rising adoption of E-beam and X-ray systems for sub-3nm defect detection.
AI Integration: AI algorithms enable 30%+ efficiency gains in defect classification and localization (e.g., KLA-Tencor solutions).
Hybrid Modalities: Optical+E-beam hybrid systems dominate for balanced speed/accuracy (e.g., Lasertec's latest models)46.
Emerging Applications
Micro-LED: Mass transfer processes demand photomask defect rates

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