Semiconductor Assembly And Packaging Equipment Market Growth Accelerates: Strategic Forecast Predicts $18.48 Billion by 2029

Use code ONLINE30 to get 30% off on global market reports and stay ahead of tariff changes, macro trends, and global economic shifts.

What Will the Semiconductor Assembly And Packaging Equipment Industry Market Size Be by 2025?
There has been robust growth in the semiconductor assembly and packaging equipment market size recently. It is anticipated to expand from $12.1 billion in 2024 to $13.15 billion in 2025, demonstrating a compound annual growth rate (CAGR) of 8.6%. The expansion in the historical period is caused by the growth in emerging markets, a surge in the need for semiconductor equipment, a higher demand for consumer electronics, and an increase in disposable income.

What's the Long-Term Growth Forecast for the Semiconductor Assembly And Packaging Equipment Market Size Through 2029?
The market for semiconductor assembly and packaging equipment is set for substantial expansion in the coming years, anticipated to reach $18.48 billion by 2029, growing at an 8.9% compound annual growth rate (CAGR). This anticipated growth over the forecast period is largely credited to governmental efforts to advance the semiconductor industry, a surging demand for electric vehicles, increasing needs from the medical sector, escalating urbanization, and a growing call for portable electronic devices. Key trends for the forecasted period incorporate a concentration on the release of novel semiconductor inspection machines employing big data and artificial intelligence (AI), innovation of new products including the unveiling of a new automatic flip-chip bonder, introduction of compound semiconductor equipment to enhance the wet process product offering, escalated investment focus, and a surge in partnerships aimed at product development.

View the full report here:
https://www.thebusinessresearchcompany.com/report/semiconductor-assembly-and-packaging-equipment-global-market-report

What Are the Key Growth Drivers Fueling the Semiconductor Assembly And Packaging Equipment Market Expansion?
The projected increase in consumer electronics demand is expected to play a significant role in the expansion of the semiconductor assembly and packaging equipment market. This rise in demand is closely intertwined with the semiconductor sector, as consumer electronics largely relies on this industry. To illustrate, the Consumer Technology Association (CTA), an American trade body, disclosed in January 2022 that they anticipate smartphone shipping will hit 154.1 million units, earning $74.7 billion in 2022, reflecting a 3% increase from 149.6 million units in 2021. Moreover, the sales of automotive technology in 2022 are anticipated to surge by 7% and reach $16 billion, up from $14.9 billion. This surge is attributed to the improvement in chip supply. Therefore, the expansion in consumer electronics is expected to heighten the demand for semiconductor assembly and packaging equipment market growth.

Get your free sample here:
https://www.thebusinessresearchcompany.com/sample.aspx?id=3687&type=smp

What Are the Key Trends Driving Semiconductor Assembly And Packaging Equipment Market Growth?
The emergence of technological progress is a notable trend that is becoming increasingly popular in the semiconductor assembly and packaging equipment industry. Companies leading the market are concentrating their efforts on implementing innovative technologies like compound equipment to enhance packaging applications. For instance, in January 2022, Shengmei Semiconductor equipment (Shanghai) Co., Ltd., a company headquartered in China that provides wafer process solutions for semiconductor foreground and advanced wafer-level packaging (WLP) applications, introduced a range of integrated equipment designed to aid in the production of compound semiconductors. This product line for compound semiconductor wet process involves gluing equipment, development equipment, photoresist de-gluing equipment, wet etching equipment, cleaning equipment, and metal plating equipment, that are fully compatible with both flat edged and notched wafers.

How Is the Semiconductor Assembly And Packaging Equipment Market Segmented?
The semiconductor assembly and packaging equipmentmarket covered in this report is segmented -

1) By Type: Plating Equipment, Inspection And Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment, And Other Types.
2) By Application: Companion Animals, Livestock.
3) By End User: OSATS (Outsourced Semiconductor Assembly And Test), IDMS (Integrated Device Manufacturers).

Subsegments:
1) By Plating Equipment: Electroplating Systems, Electroless Plating Systems, Plating Process Control Equipment
2) By Inspection And Dicing Equipment: Automated Optical Inspection (AOI) Systems, X-Ray Inspection Systems, Dicing Saws And Dicing Systems
3) By Wire Bonding Equipment: Thermosonic Wire Bonders, Wedge Bonders, Ball Bonders
4) By Die-Bonding Equipment: Automated Die Bonders, Manual Die Bonders, Flip-Chip Bonders
5) By Other Types: Encapsulation And Molding Equipment, Test And Handling Equipment, Laser Marking Equipment

Tailor your insights and customize the full report here:
https://www.thebusinessresearchcompany.com/customise?id=3687&type=smp

Which Companies Are Leading the Charge in Semiconductor Assembly And Packaging Equipment Market Innovation?
Major companies operating in the semiconductor assembly and packaging equipment market include Tokyo Electron Ltd, Applied Materials, Inc, Kulicke and Soffa Industries, Inc, ASML Holding N.V, BE Semiconductor Industries N.V, Tokyo Seimitsu, Amkor Technology, ASM Pacific Technology, Screen Holdings Co. Ltd, KLA-Tencor, Toshiba Corp, Renesas Electronics Corporation, Fujitsu Limited, Panasonic Corporation, Continental Device India Ltd (CDIL), MosChip Semiconductor Technologies, Advanced Semiconductor Engineering Inc, Zhixin Semiconductor, UNISOC, Yangtze Memory Technologies Co., Ltd (YTMC), GigaDevice, CR Micro, Silan, Infineon Technologies AG, UnitySC, Lam Research Corporation, Hitachi High Technologies Corporation, Advantest, Teradyne Inc, Smart Modular Technologies, Multilaser, Flextronics, STMicroelectronics, ROHM Semiconductor, Semiconductors and Technologies Limited Company

Which Regions Are Leading the Global Semiconductor Assembly And Packaging Equipment Market in Revenue?
Asia-Pacific was the largest region in the semiconductor assembly and packaging equipment market in 2024. Western Europe was the second-largest region in the global semiconductor assembly and packaging equipment market share. The regions covered in the semiconductor assembly and packaging equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa

Purchase the full report today:
https://www.thebusinessresearchcompany.com/purchaseoptions.aspx?id=3687

This Report Supports:
1.Business Leaders & Investors - To identify growth opportunities, assess risks, and guide strategic decisions.
2.Manufacturers & Suppliers - To understand market trends, customer demand, and competitive positioning.
3.Policy Makers & Regulators - To track industry developments and align regulatory frameworks.
4.Consultants & Analysts - To support market entry, expansion strategies, and client advisory work.

Connect with us on:
LinkedIn: https://in.linkedin.com/company/the-business-research-company,
Twitter: https://twitter.com/tbrc_info,
YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ.

Contact Us
Saumya Sahey
Europe: +44 7882 955267,
Asia: +44 7882 955267 & +91 8897263534,
Americas: +1 310-496-7795
Email: saumyas@tbrc.info

Learn More About The Business Research Company
With over 15,000+ reports from 27 industries covering 60+ geographies, The Business Research Company has built a reputation for offering comprehensive, data-rich research and insights. Our flagship product, the Global Market Model delivers comprehensive and updated forecasts to support informed decision-making.

This release was published on openPR.