Global NearLink Chips Market 2025 Outlook Market Size USD 277 Million CAGR 12% Huawei Hisilicon and Chuangyao Technology Leading

The NearLinkTM ecosystem is entering a decisive acceleration phase. Building on standardization milestones in 2024 and new commercial deployments in 2025, chipmakers and OEMs are translating NearLink's ultra-low latency and high reliability into tangible product rollouts across automotive, smart home, and industrial applications. Below we synthesize the latest developments alongside fresh market data from QYResearch Global NearLink Chips Market Outlook, In-Depth Analysis & Forecast to 2031.

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Latest Market Data
• Global Market Size: US$ 277 million in 2024, projected to reach US$ 612 million by 2031
• CAGR (2025-2031): 12.0%
• Regional scope: North America, Europe, Asia-Pacific, South America, Middle East & Africa
• Leading downstream 2024: Smart Home
• Report coverage: revenue and volume forecasts, company share, competitive landscape, growth factors, and trends

On 2024 market revenue of US$277M, the estimates are: COGS ≈ US$125-152M; Gross Profit ≈ US$125-152M; Gross Margin ≈ 45-55%. At the midpoint (50%), COGS ≈ US$139M and Gross Profit ≈ US$139M. This band is also consistent with Telink's ~45-50% gross-margin profile.

Leading Companies
Huawei Hisilicon
Chuangyao Technology
Chengdu Aich Technology
Beijing Sylincom Technology
Telink

Application List
Smart Home
Smart Manufacturing
Smart Automobilie
Consumer Electronics

Classification List
1.0 Standard
2.0 Standard
3.0 Standard

What's New in 2024-2025
NearLink 2.0 was released in 2024, extending standards to native audio/video, human-machine interaction, and positioning, creating a framework for consistent multi-device experiences.

In April 2024, the NearLink Digital Car Key standard was published, with participation from Huawei and BYD. By 2025, Huawei HiSilicon confirmed that AITO and LUXEED vehicles would support NearLink car keys, while more than 50 million smartphones are expected to be NearLink-ready by Q4 2025.

In January 2025, CETC's 55th Institute completed intercontinental NearLink verification, demonstrating robust chip and protocol stack stability in mission-critical environments.

Certification frameworks matured, with CAICT publishing test standards and DEKRA launching compliance services, laying the foundation for global interoperability.

Consumer electronics adoption accelerated as Haier, Changhong, and Casarte introduced NearLink appliances, while broadcasters began testing set-top boxes and remote controls using NearLink technology.

Five Flagship Products
Huawei Hisilicon - Hi3873V100
• Wi-Fi 6 (2.4 GHz, up to 150 Mbps) + NearLink SLE (1/2/4 MHz, up to 12 Mbps, gateway capable)
• USB 2.0 / SDIO 2.0 host interfaces
• 32-bit MCU at 240 MHz with 300 KB SRAM and 430 KB ROM
• Industrial temperature range -40 °C to +85 °C, QFN32 4×4 mm package
Chuangyao Technology - TR5330
• Wi-Fi 6 + SLE + BLE 5.4 combo chip
• SLE up to 12 Mbps, BLE up to 2 Mbps
• USB 2.0 and SDIO 2.0 host interfaces
• Built-in 32-bit MCU and security engine
• Targeted for IP cameras, smart appliances, robots, drones, and TVs
Chengdu Aich Technology - AiW9761
• 2.4 GHz Wi-Fi 6 (20/40 MHz, up to 150 Mbit/s)
• Tx power up to 23 dBm, Rx sensitivity down to -99 dBm
• BLE 5.2 with 2 Mbps, SLE 2 MHz with 4 Mbps
• USB 2.0 and SDIO interfaces
• Designed for IP cameras, DVRs, entry-level TVs, robot vacuums, and drones
Beijing Sylincom Technology - DX-T600 with SLM10/SLM600 Modules
• SLB chip enabling ultra-low latency (~20 μs) and 99.999% reliability
• Designed for wireless automotive surround-view and synchronized multi-camera systems
• Among the first SLB modules released to industry
Telink - NearLink Chip (2025 launch target)
• Built on TL721x multi-standard platform (BLE 6.0, Zigbee, Thread, Matter, proprietary 2.4 GHz)
• RISC-V core with 512 KB SRAM and 2 MB Flash
• Module options sized around 18×35.3×2.6 mm
• Target applications include wearables, HID devices, and smart home products

Verified Downstream Customers
Huawei Technologies
BYD Company
Changan Automobile
GAC Group
FAW Group
Dongfeng Motor Group
Seres Group
Chery Automobile
Haier Group
Changhong
Casarte
Jiangsu Broadcasting Cable Information Network Corporation Limited
EagleDrive Technology

Market Trend
From Early Standard to Mature Ecosystem
NearLink 2.0 provided the foundation for interoperability across audio/video, positioning, and HMI. This dramatically reduces OEM integration complexity and creates a standardized pathway similar to Wi-Fi's early expansion years.

Automotive at the Forefront
Digital car keys became the flagship use case, with 2025 marking the first shipping models. By pairing smartphones and vehicles, NearLink removes the distance and accuracy limitations of NFC, with a forecasted installed base surpassing 50 million active devices this year.

SLB for Low-Latency and High Reliability
SLB enables 20-microsecond-class latency with five-nines reliability. These specifications transform automotive surround-view systems and industrial robotics, ensuring synchronized sensor data without jitter or frame drift.

Appliances and Broadcasting Move In
Appliance makers Haier, Changhong, and Casarte shifted NearLink from lab demos to consumer products, while broadcasters began integrating NearLink into set-top boxes. This creates new demand streams with longer product cycles than smartphones.

Multi-Mode Chips Dominate
Combo chips combining Wi-Fi, SLE, and BLE are becoming standard. Huawei, Chuangyao, and Aich products demonstrate that integration reduces BOM costs and simplifies updates. This trend supports a broad spectrum of devices, from consumer appliances to industrial gateways.

Certification Accelerates Time-to-Market
CAICT and DEKRA's certification frameworks make multi-vendor NearLink interoperability a reality. This reduces risk for carmakers and broadcasters, paving the way for global expansion.

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Aerospace and Critical Infrastructure
Verification by CETC in early 2025 demonstrated NearLink's viability in mission-critical systems. The technology's robustness is expected to influence future adoption in aerospace, energy, and industrial control environments.

Broader Vendor Participation
Telink's entry in 2025 shows the widening appeal of NearLink beyond Huawei-led initiatives. With its multi-protocol approach, Telink will drive adoption across wearables, healthcare devices, and IoT ecosystems.

Chapter Outline:

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: key insights, key emerging trends, etc.
Chapter 3: Manufacturers competitive analysis, detailed analysis of the product manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 5 & 6: Sales, revenue of the product in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 7: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: The main points and conclusions of the report.

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