SiC Wafer Grinder Market Size Projected Surge at 17.1% CAGR by 2031 | Disco, TSD, TOKYO SEIMITSU

Los Angeles, United States - QY Research has released a comprehensive new report titled "Global SiC Wafer Grinder Market Insights, Forecast 2025 to 2031," offering an in-depth analysis of the evolving dynamics, growth opportunities, and future outlook of the global SiC Wafer Grinder industry. The study highlights critical factors such as regulatory frameworks, technological advancements, pricing strategies, and market entry approaches that are shaping the sector.

The global SiC Wafer Grinder market was valued at US$ 114 million in 2024 and is anticipated to reach US$ 340 million by 2031, witnessing a CAGR of 17.1% during the forecast period 2025-2031.

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Market Overview -

The global SiC Wafer Grinder market is undergoing significant transformation, driven by innovation, strategic partnerships, and rising demand across multiple applications. The report provides a holistic evaluation of both production and consumption trends, delivering clarity on supply-demand imbalances and investment opportunities.

SiC wafer grinding machine is a special equipment used to grind SiC (silicon carbide) wafers. It is mainly driven by an electric or pneumatic motor to drive a rotating shaft, and the material is removed through the saw teeth on the cutting disc or with a cutting blade. During the grinding process, the SiC wafer grinder uses tools made of cemented carbide or superhard materials to perform high-speed rotational cutting on the surface of the workpiece, causing the blank to deform and lose its stability, and then separate from the whole. This equipment plays an important role in the production and processing of SiC wafers due to its high efficiency, accuracy and good adaptability to the hardness and corrosion resistance of SiC materials.

The global SiC Wafer Grinders market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications. The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share. This trend is expected to continue due to the region's strong semiconductor industry, technological advancements, and growing demand for energy-efficient power devices.

The global key manufacturers of SiC Wafer Grinder include Disco, TSD, etc. In 2023, the global top five players had a share approximately 81% in terms of revenue.

Among different types of SiC Wafer Grinder, fully automated systems dominate the market, capturing approximately 77% of the total share in 2024. This reflects the industry's growing demand for precision, scalability, and high-efficiency production processes. Fully automated equipment provides improved throughput and minimizes the risk of human error, making it the preferred choice for manufacturers aiming to scale their operations and ensure high-quality output.

Interms of applications, wafers sized 6 inches and below are the primary demand drivers. These smaller wafers make up approximately 70% of the market in 2024. The widespread use of smaller wafers in power electronics and semiconductor devices, particularly in electric vehicles and renewable energy applications, supports this demand. As SiC continues to gain traction in the power semiconductor sector, the demand for wafer thinning equipment for smaller wafer sizes is expected to increase.

Market Driving Factors -

Expansion of the Electric Vehicle (EV) Market: SiC materials are particularly suitable for use in power modules for electric vehicles (EVs) due to their superior thermal conductivity and high voltage tolerance. With the rapid growth of the electric vehicle market, the demand for SiC wafers is increasing, which in turn drives the demand for wafer thinning equipment.

Advances in Energy Conversion and Storage Technologies: In high-efficiency energy conversion and storage fields, such as solar inverters and battery management systems, the use of SiC materials can significantly improve efficiency. The market's demand for high-performance components has driven the production and thinning of SiC wafers.

Demand for 5G and High-Frequency Electronics: The demand for SiC materials is rising in 5G networks and other high-frequency electronic devices due to SiC's excellent performance in high-frequency and high-power applications. This has led to an increase in the demand for SiC wafer production and processing equipment.

Market Restraints -

Process Complexity: The wafer thinning process for SiC wafers involves high-precision techniques and is technically challenging. The instability of the process may lead to quality issues, affecting market confidence.

Intensifying Competition: As the SiC market rapidly develops, more companies are entering the field, and market competition is becoming increasingly intense. This may lead to price wars and margin compression.

Technological Iteration: With the fast pace of technological updates, the introduction of new technologies and equipment may quickly render existing equipment obsolete. Companies need to continue investing in research and development to maintain competitiveness.

In addition to market dynamics, the study examines both growth drivers-such as technological innovation and increasing adoption in key industries-and restraints, including cost challenges and regulatory hurdles.

Featured Companies: -

Disco
TSD
TOKYO SEIMITSU
Engis Corporation
Okamoto Semiconductor Equipment Division
Revasum
Koyo Machinery
G&N

Key Highlights of the Report -

Historical Analysis (2020-2024) & Forecasts (2025-2031): Gain insights into past performance and future growth potential.

Comprehensive Segmentation: Detailed market breakdown by type, application, and region.

Competitive Landscape: Thorough profiling of leading companies, their market shares, product portfolios, and recent developments.

Market Dynamics: Identification of drivers, restraints, challenges, and emerging opportunities.

Expert Insights: Forward-looking perspectives on industry risks and growth strategies.

Detailed of SiC Wafer Grinder Market Segmentation: -

Segmentation By Type :-

Full-Automatic
Semi-Automatic

Segmentation By Application : -

6 inches and Below
8 inches and Above

This segmentation helps identify high-growth opportunities and niche segments for investors and businesses.

Regional Insights -

The SiC Wafer Grinder market is geographically diverse, with demand and innovation spread across multiple regions:

North America: United States, Canada, Mexico

Latin America: Brazil and other key markets

Asia Pacific: China, Japan, South Korea, India, ASEAN countries

Europe, Middle East & Africa (EMEA): Major European economies, GCC countries, and African nations

The report provides a region-wise breakdown of market share, consumption trends, and future prospects.

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What You'll Gain from This Report -

> In-Depth Regional Analysis: Explore market potential across North America, Europe, Asia Pacific, Latin America, and the Middle East & Africa.

> Competitive Intelligence: Profiles of key players, including their sales, revenue, product portfolios, and recent developments.

> Market Dynamics: Understand the latest trends, driving factors, and risks impacting the industry.

> Actionable Insights: Make informed business decisions with data-driven strategies and forecasts.

How Can the Research Study Help your Business?

(1) The information presented in the SiC Wafer Grinder report helps your decision makers to become prudent and make the best business choices.

(2) The report enables you to see the future of the global SiC Wafer Grinder market and accordingly take decisions that will be in the best interest of your business.

(3) It offers you a forward-looking perspective of the global SiC Wafer Grinder market drivers and how you can secure significant market gains in the near future.

(4) It provides SWOT analysis of the global SiC Wafer Grinder market along with useful graphics and detailed statistics providing quick information about the market's overall progress throughout the forecast period.

(5) It also assesses the changing competitive dynamics of the global SiC Wafer Grinder market using pin-point evaluation.

This SiC Wafer Grinder Market Research Report Contains Answers to your following Questions -

(A) Which Manufacturing Technology is Used for SiC Wafer Grinder? What Developments Are Going On in That Technology? Which Trends Are Causing These Developments?

(B) Who Are the Global Key Players in This SiC Wafer Grinder Market? What's Their Company Profile, Their Product Information, and Contact Information?

(C) What Was Global Market Status of SiC Wafer Grinder Market? What Was Capacity, Production Value, Cost and PROFIT of SiC Wafer Grinder Market?

(D) What Is Current Market Status of SiC Wafer Grinder Industry? What's Market Competition in This Industry, Both Company, and Country Wise? What's Market Analysis of SiC Wafer Grinder Market by Taking Applications and Types in Consideration?

(E) What Are Projections of Global SiC Wafer Grinder Industry Considering Capacity, Production and Production Value? What Will Be the Estimation of Cost and Profit? What Will Be Market Share, Supply and Consumption? What about Import and Export?

(F) What Is SiC Wafer Grinder Market Chain Analysis by Upstream Raw Materials and Downstream Industry?

(G) What Is Economic Impact On SiC Wafer Grinder Industry? What are Global Macroeconomic Environment Analysis Results? What Are Global Macroeconomic Environment Development Trends?

(H) What Are Market Dynamics of SiC Wafer Grinder Market? What Are Challenges and Opportunities?

(I) What Should Be Entry Strategies, Countermeasures to Economic Impact, Marketing Channels for SiC Wafer Grinder Industry?

Chapter Outline:

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: key insights, key emerging trends, etc.

Chapter 3: Manufacturers competitive analysis, detailed analysis of SiC Wafer Grinder manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 5 & 6: Sales, revenue of SiC Wafer Grinder in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 7: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 8: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 10: The main points and conclusions of the report.

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