Press release
AI Datacenter Liquid Cooling Market to Surge to USD 15.7 Billion by 2035, Driven by AI Workload Growth and Thermal Management Innovations
The global AI datacenter liquid cooling market is poised for rapid expansion, with projections indicating a growth trajectory from USD 3.2 billion in 2025 to an estimated USD 15.7 billion by 2035. This remarkable increase of USD 12.5 billion over the forecast period represents a compound annual growth rate (CAGR) of 16.9%, nearly quintupled growth by the end of the decade. As artificial intelligence (AI) and machine learning (ML) technologies drive more complex computational workloads, the demand for high-performance cooling solutions is reaching unprecedented heights.Unlock detailed analytics - Request your personalized report now!
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AI Workload Intensity Sparks Need for Advanced Cooling Solutions
The rapid proliferation of AI-driven workloads, particularly those centered on generative AI and large-scale machine learning applications, has accelerated the need for effective thermal management solutions. AI chips like NVIDIA's H100 and AMD's MI300X are designed to process large datasets and execute complex algorithms, generating heat densities that traditional air cooling methods cannot manage effectively. Liquid cooling solutions, which can handle extreme thermal loads, are increasingly being adopted by hyperscale datacenters to ensure both optimal performance and energy efficiency.
By 2030, the market is projected to grow to USD 7.2 billion as AI workloads become more commonplace, especially within hyperscale datacenters, which require cutting-edge cooling solutions to support AI accelerators. The widespread implementation of liquid cooling solutions in major cloud providers such as Microsoft, Google, and Meta has set the stage for growth in the 2025-2035 period.
Energy Efficiency and Sustainability Driving Adoption
Energy efficiency standards, such as those outlined in the EU Green Deal and the U.S. Department of Energy (DOE) regulations, are also playing a pivotal role in the shift toward liquid cooling systems. Compared to traditional air cooling methods, liquid cooling systems can reduce power consumption by 20-40%, an important metric in meeting regulatory mandates for power usage effectiveness (PUE) improvements. This reduction in energy use aligns with the broader sustainability goals of datacenter operators, especially those expanding their AI infrastructure.
Dominant Segments and Competitive Landscape
Direct-to-chip liquid cooling technology is expected to hold a dominant 47% share of the AI datacenter cooling market by 2025. By delivering coolant directly to high-power components such as CPUs and GPUs through cold plates, this method achieves superior thermal performance and greater efficiency than air cooling systems. As AI hardware becomes more power-intensive, direct-to-chip solutions will be crucial in maintaining performance and reliability.
Regionally, North America, Asia Pacific, and Europe are expected to drive the largest share of the market, with strong adoption in the U.S., Germany, India, and China. In particular, U.S.-based hyperscale datacenter providers such as NVIDIA, Microsoft, and Google will lead the charge, capitalizing on advancements in AI workload clustering, which require high-density cooling solutions.
Key Players and Competitive Dynamics
Key players in the AI datacenter liquid cooling market include Schneider Electric, Vertiv Holdings, Submer Technologies, LiquidStack, and CoolIT Systems. These companies are actively innovating in direct-to-chip cooling, immersion cooling, and AI-powered thermal management systems. Schneider Electric is set to lead the market with a projected 12% share in 2025, thanks to its integrated approach that combines liquid cooling with power distribution and monitoring systems for datacenter infrastructure management.
As the market continues to expand, significant consolidation is anticipated, with larger players acquiring specialized technology companies to enhance their capabilities and meet the growing demand for AI-driven cooling solutions.
Segmental Insights
Cooling Technology: Direct-to-chip liquid cooling will command a 47% share of the market in 2025, followed by immersion cooling and rear-door heat exchangers.
Deployment Type: Hyperscale AI datacenters will lead the way, accounting for 55% of deployments, with colocation and enterprise AI datacenters trailing at 27% and 18%, respectively.
Coolant Medium: Dielectric fluids will capture 51% of the market in 2025, followed by water-based coolants and hybrid fluids.
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