Proficiency's Executive to Speak at 3D Collaboration and Interoperability 2008 ConferenceAlex Tsechansky to Address Breakthrough Developments in Product Knowledge Interoperability -
Marlborough, Mass., April 10, 2008 – Proficiency, the leading developer of solutions that enable manufacturers and their suppliers to extract and share product knowledge from diverse engineering and manufacturing environments today announced that Vice President of Research and Development, Alex Tsechansky, will present during the 3D Collaboration and Interoperability conference (www.3Dinterop.com), being held at the Denver Athletic Club in Denver, Colorado, May 15-16.
“We are quite pleased to have Mr. Tsechansky presenting at the conference, said David Prawel, Conference Chair and President at Longview Advisors. “Very few vendors present at this conference, due to strict limitations by the conference Advisory Board. The fact that the Board requested a presentation from Proficiency is evidence that the continuous, secure flow of product knowledge throughout the extended enterprise has clearly become a strategic imperative, and that Proficiency’s solutions are successfully addressing this need.”
Mr. Tsechansky will discuss the migration of 3D models between CAD systems which is traditionally considered a tedious, non-value add process. The most commonly used practices of geometric translation (e.g. IGES, STEP, and JT) or manual re-mastering in the new CAD system have severe drawbacks and can damage the product knowledge accumulated over years in the 3D models. Breakthrough developments in feature-based 3D interoperability allow companies to retain product knowledge and even extract additional added value from a CAD migration. This results in fully functional models in the target CAD systems, which retain the original product knowledge while providing a reliable basis for further development. Looking into the near future, CAD product knowledge migrations will end up with higher quality models than those in the source CAD. The presentation will provide an overview of product knowledge migration and feature-based interoperability technology, applications and methodology, along with case studies of successful deployment by selected automotive and aerospace companies. Part of the presentation will be dedicated to demonstrate the capabilities of the Completion Wizard, a newly released application, and its benefits.
Mr. Tsechansky manages Proficiency's Technology Center and is responsible for all R&D and Service Bureau activities. He previously headed the development of the next-generation 3D solid modeler for Cimatron, a NASDAQ-traded CAD/CAM company.
Also at the conference, Proficiency will be showcasing its recently released Collaboration Gateway VersionTM 7.0 CAD interoperability solution and new and powerful Completion WizardTM. The new version includes improved performance and reporting capabilities, 64 bit memory support, higher exchange rates based on new functionality, user enhancements for project management and new CATIA V4 to CATIA V5 functionality. Also being shown is the brand new Completion Wizard™ product that interactively allows the engineer to complete and validate the final model.
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About Proficiency, Inc. (http://www.proficiency.com)
Proficiency, Inc., headquartered in Massachusetts, is the leading developer of solutions that enable manufacturers and their suppliers to extract and share product knowledge from diverse engineering and manufacturing environments.
Global enterprises in the automotive, aerospace & defense, and heavy machinery industries such as Ford Motor Company, Boeing, Daimler, European Aeronautic Defense & Space Company (EADS), and Bombardier, Inc. use Proficiency's Collaboration Gateway™ in their heterogeneous PLM and multi-CAD environments to ensure effective product knowledge integration (PKI) during design and manufacturing processes. The solution significantly reduces cost, risks, and errors while improving profitability by shortening delivery times, promoting re-use and protecting intellectual property (IP) assets during collaboration.
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