Film for Semiconductor Packaging Market Size, Volume, Revenue, Trends Analysis Report 2025

On Sep 12, Global Info Research released "Global Film for Semiconductor Packaging Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031". This report includes an overview of the development of the Film for Semiconductor Packaging industry chain, the market status of Film for Semiconductor Packaging Market, and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Film for Semiconductor Packaging.

According to our (Global Info Research) latest study, the global Film for Semiconductor Packaging market size was valued at US$ 2006 million in 2024 and is forecast to a readjusted size of USD 3452 million by 2031 with a CAGR of 7.9% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Packaging is a process of placing, fixing, sealing, and connecting chip contacts to the package shell through specific materials and process technologies. Its core role is to protect chip performance and extend internal functions to the outside. The basic packaging process covers key links such as wafer grinding, wafer cutting, die attach, and molding.
After the semiconductor wafer is manufactured in the Fab plant, it needs to be reduced in thickness by back thinning (Back Grinding) according to the chip packaging size requirements before packaging; after thinning, it is cut (Dicing/Sawing) according to the die size (Die Size) to obtain the target size, and then enters the packaging stage after processes such as die picking and die bonding.
As the grain size develops towards miniaturization, the packaging process has derived diversified technologies, and some links may require film assistance. This has led to the demand for film materials in different processes. These films are mainly used for surface protection or adhesion during packaging. Specific types include wafer grinding tape, Dicing tape, DAF film, wafer back side protection film, release film, PI film/tape, etc.
This article focuses on the statistics of films/tapes used in traditional semiconductor packaging and advanced packaging processes.
This report is a detailed and comprehensive analysis for global Film for Semiconductor Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

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Market segment by Type: Dicing Tape、 BG Tape、 Release Film、 Wafer Backside Protection Film、 Die Attach Film、 PI Film/Tape、 Other Film
Market segment by Application: Advanced Packaging Process、 Traditional Packaging Process
Major players covered: Mitsui Chemicals、 LINTEC Corporation、 SEKISUI CHEMICAL、 Resonac、 Nitto Denko、 Furukawa Electric、 Sumitomo Bakelite、 Denka、 D&X Co., Ltd、 Narachem Co., Ltd、 Eleven Electron、 SANG-A FRONTEC、 Henkel、 WaferChem、 MTI ECO INNO、 Jiangsu Telilan Coating Technology Co., Ltd、 KOBAYASHI & CO.、 AGC、 LG Chem、 Tomoegawa Corporation、 Alliance Material Co., Ltd、 Asahi Kasei Corporation、 Taicang Zhanxin Adhesive Material、 Vistaic、 KGK Chemical Corporation、 ULTRON SYSTEM、 Maxell Holdings、 3M、 Shanghai Guke、 Cybrid Technologies Inc、 Solar Plus Company
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Film for Semiconductor Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Film for Semiconductor Packaging, with price, sales, revenue and global market share of Film for Semiconductor Packaging from 2020 to 2025.
Chapter 3, the Film for Semiconductor Packaging competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Film for Semiconductor Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Film for Semiconductor Packaging market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Film for Semiconductor Packaging.
Chapter 14 and 15, to describe Film for Semiconductor Packaging sales channel, distributors, customers, research findings and conclusion.

Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.

From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.
Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.

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