Computility Thermal Structure Research:CAGR of 20.4% during the forecast period

Computility Thermal Structure Market Summary

​Computility thermal structures serve as core metal components that provide mechanical support and thermal conduction paths for cooling systems in high-computility devices such as AI servers, GPU accelerator cards, and data center switches. These structures encompass precision diecast or CNC-machined liquid-cooling plate substrates, high-thermal-conductivity fin array brackets, high-pressure-resistant sealed enclosures, and customized heat dissipation frames for heterogeneous computing chips. Designed to meet requirements including high heat flux density, multidimensional thermal topologies, and long-term corrosion resistance, their materials-such as copper alloys and aluminum silicon carbide (AlSiC)-and manufacturing processes-like ultrathin channel milling and vacuum brazing-directly determine the thermal efficiency and reliability of computility hardware. Critically, they act as essential physical interfaces bridging heat-generating units and active cooling components such as liquid-cooling pumps or immersion cooling systems.​

According to the new market research report "Global Computility Thermal Structure Market Report 2025-2031", published by QYResearch, the global Computility Thermal Structure market size is projected to grow from USD 729.08 million in 2024 to USD 2489.83 million by 2031, at a CAGR of 20.4% during the forecast period.

Figure00001. Global Computility Thermal Structure Market Size (US$ Million), 2020-2031

Computility Thermal Structure

Above data is based on report from QYResearch: Global Computility Thermal Structure Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.

Figure00002. Global Computility Thermal Structure Market Share by Application Area (US$ Million) (Ranking is based on the revenue of 2025, continually updated)

Computility Thermal Structure

Above data is based on report from QYResearch: Global Computility Thermal Structure Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.

From this figure, server have the largest market share.

Figure00003. Computility Thermal Structure, Market Share of Server (US$ Million)

Computility Thermal Structure

Based on or includes research from QYResearch: Global Computility Thermal Structure Market Report 2025-2031.

Computility thermal structures in the server sector specifically refer to core thermal management components engineered to dissipate heat generated by high-performance computing chips such as CPUs and GPUs. These structures leverage air cooling, liquid cooling, phase-change materials, and other technologies to achieve efficient heat exchange, ensuring stable device operation. As AI computility demands surge-with chip Thermal Design Power (TDP) now exceeding 700W and even 1000W-traditional air cooling approaches its thermal limits, while liquid cooling has become the dominant trend due to liquids' significantly higher heat capacity than air and notable energy efficiency gains. Among liquid cooling solutions, cold-plate systems have scaled rapidly owing to their high compatibility, whereas immersion cooling emerges as the long-term direction for its simplified architecture and superior thermal density.​​

​​Innovations span material advancements like graphene and carbon nanotubes boosting thermal conductivity, alongside structural breakthroughs such as 3D vapor chambers and microchannel designs overcoming spatial constraints. Intelligence is integrated through sensors dynamically regulating cooling strategies. Concurrently, cross-layer co-design is shifting thermal management from standalone modules to system-level solutions, addressing the reliability and cost challenges of high-density computility deployment.​

In the consumer electronics sector, Computility Thermal Structures specifically denote thermal management components engineered to address the escalating power consumption of high-performance chips (e.g., CPUs, GPUs) in smartphones, laptops, and similar devices. These structures leverage technologies such as graphene films, heat pipes, and vapor chambers to enable efficient heat transfer, ensuring stable operation under dual constraints of ultra-slim form factors and high performance. Amid surging 5G/AI computility demands and rising chip power limits, thermal management technology is undergoing three transformations.​​

​​Material and structural innovations drive progress, with ultra-thin heat pipes and vapor chambers evolving toward lighter designs while carbon nanotube-enhanced graphene composites boost thermal conductivity and liquid metal phase-change materials enable precise temperature control. Composite solutions are gaining widespread adoption, particularly graphene combined with heat pipes or vapor chambers (VCs) in multilayer configurations for smartphones, alongside hybrid architectures like "heat pipes + liquid-cooling plates + smart fans" in premium laptops handling heavy workloads. Simultaneously, intelligence and integration are advancing through sensors that dynamically regulate cooling power, such as temperature-responsive fans, shifting thermal systems from standalone modules to deeply embedded components within device structures. Biomimetic designs further optimize spatial efficiency. Looking ahead, thermal structures will increasingly converge novel materials with intelligent algorithms to propel consumer electronics toward ultra-high performance and ultraslim evolution.​

​In the communication device sector, computility thermal structures specifically denote thermal management components designed to ensure stable operation of high-density devices such as 5G base stations, edge computing nodes, and network switches. These components tackle heat accumulation in critical parts like RF chips and processors under sustained heavy workloads through highly conductive materials coupled with hybrid solutions including liquid cooling and phase-change systems. Their development trajectory aligns with evolving demands for communication equipment miniaturization, higher-frequency operation, and energy efficiency upgrades. Liquid cooling is rapidly displacing traditional air cooling due to superior heat dissipation, quieter operation, and high-power compatibility, where cold-plate systems now dominate mainstream deployment for their adaptability while immersion cooling emerges as the strategic long-term direction given its higher thermal density. Simultaneously, intelligent dynamic control systems reduce energy consumption by automatically adjusting cooling strategies based on real-time load temperature monitoring, alongside advanced materials like carbon nanotubes and graphene composites enhancing thermal conductivity to propel weight-reduced architectures and greater reliability with environmental resilience. Furthermore, cross-layer collaborative design and module standardization are accelerating industrial adoption to address escalating thermal challenges as communication systems advance.

Beyond the domains, computility thermal structures extend to critical applications including automotive computing, industrial computers, and medical equipment. These integrated thermal management systems address heat generated during continuous operation of high-power chips-such as automotive AI processors, industrial control units, and medical imaging GPUs-in complex environments, employing hybrid cooling technologies to ensure device stability and energy efficiency. Their evolution centers on scenario-specific imperatives. In automotive contexts, surging computational demands for autonomous driving necessitate thermal structures balancing efficient heat transfer, lightweight construction, and anti-vibration/dust-resistant designs while coordinating with battery thermal management to withstand high-temperature conditions and prolong component lifespan. For industrial settings, enhanced environmental resilience enables dynamic power regulation via intelligent thermal control systems, alongside modular designs that simplify maintenance to meet industrial automation's reliability and non-stop production requirements. Medical devices prioritize near-silent operation and particle-free environments, utilizing microchannel liquid cooling or fanless architectures to prevent interference with precision diagnostics like MRI and CT scanners, while advanced materials like carbon nanotubes boost thermal efficiency within compact footprints.​​

​​Future advancements will accelerate cross-domain technology convergence, exemplified by automotive liquid cooling borrowing immersion-cooling expertise from data centers, industrial structures integrating edge computing's AI-optimization algorithms, and medical equipment adopting space-grade phase-change materials-collectively pioneering a shift toward high-density, low-consumption thermal solutions with full lifecycle management capabilities.​

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