Press release
Strategic Outlook: Vacuum Reflow Soldering Ovens Market Size, Trends, and Forecast to 2031
Vacuum Reflow Soldering Ovens Market Size and Growth OpportunitiesThe global Vacuum Reflow Soldering Ovens Market was valued at US$ 128 million in 2024 and is projected to reach US$ 165 million by 2031, growing at a CAGR of 3.8% during the forecast period.
In the vacuum reflow process, the vacuum stage that removes pores from the liquid solder follows the actual melting process. Vacuum reflow oven systems have demonstrated the ability to reduce void levels below 5%, enhancing the reliability of electronic components across industries.
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Key Market Players and Competitive Landscape
Global leaders in the Vacuum Reflow Soldering Ovens Market include Rehm Thermal Systems, Kurtz Ersa, Heller Industries, SMT Wertheim, and BTU International. Collectively, the top five players control over 65% of the market share.
• Asia-Pacific dominates with ~69% share, supported by strong electronics manufacturing bases in China, Taiwan, South Korea, and Japan.
• North America and Europe follow with 13% and 12% market share, driven by advanced R&D and adoption in high-end electronics and automotive sectors.
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Market Segmentation
By Type:
• Less than 10 Heating Zones
• 10-20 Heating Zones
• More than 20 Heating Zones
By Application:
• Telecommunication
• Consumer Electronics
• Automotive
By Company:
Rehm Thermal Systems, Kurtz Ersa, Heller Industries, SMT Wertheim, BTU International, Shenzhen JT Automation, HIRATA Corporation, Senju Metal Industry Co., Ltd, ATV Technologie GmbH, 3S Silicon, EIGHTECH TECTRON
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