Global Chip Mounter In-Depth Industrial and Market studies 2016-2020

Albany, New York, Jan 17,2017

"Global Chip Mounter Market 2016-2020" The Report covers current Industries Trends, Worldwide Analysis, Global Forecast, Review, Share, Size, Growth, Effect.

Description-

The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the last two decades. Thus, the chip mounting technology has moved from a big diameter to a small diameter of space.

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* Technavios analysts forecast the global chip mounter market to grow at a CAGR of 8.05% during the period 2016-2020.

– Covered in this report
The report covers the present scenario and the growth prospects of the global chip mounter market for 2016-2020. To calculate the market size, the report considers revenue from the sales of chip mounter equipment.

– The market is divided into the following segments based on geography:
Americas
APAC
EMEA

Technavio's report, Global Chip Mounter Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

– Key vendors
Hitachi
Juki Corporation
Nitto Denko Corporation
Panasonic
Yamaha Corporation

– Other prominent vendors
ASM Pacific Technology
Canon
Essemtec
Ohashi Engineering
Nordson
Samsung Techwin
Sony
Sun Electric Industries
TOA

– Market driver
Growing adoption of communication-related consumer electronic gadgets
For a full, detailed list, view our report

– Market challenge
Uncertain global economic conditions
For a full, detailed list, view our report

– Market trend
Emergence of wearable technology
For a full, detailed list, view our report

– Key questions answered in this report
What will the market size be in 2020 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

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