Wafer Grinding Equipment Market Share Driven by Semiconductor and Photovoltaic Advancements | Valuates Reports

Wafer Grinding Equipment Market Size
The global market for Wafer Grinding Equipment was valued at US$ 1224 million in the year 2024 and is projected to reach a revised size of US$ 1988 million by 2031, growing at a CAGR of 7.0% during the forecast period.

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The wafer grinding equipment market is experiencing significant market growth as semiconductor manufacturing and photovoltaic production expand worldwide. Increasing demand for precision wafer processing, higher yields, and improved surface quality is shaping key market trends and driving market size. Technological advancements, automation, and rising adoption of high-efficiency solar cells are further reinforcing the importance of wafer grinding equipment across industries.

By type, wafer surface grinders hold the largest market share due to their widespread use in achieving precise thickness and smoothness required for high-performance wafers. Wafer edge grinders are emerging as the fastest-growing type segment, driven by their critical role in minimizing edge defects and enhancing overall device reliability. Both types continue to contribute to market growth, addressing diverse processing requirements in modern wafer fabrication.

In terms of application, the semiconductor sector represents the largest market share, supported by ongoing innovation in microelectronics, integrated circuits, and advanced device manufacturing. The photovoltaic sector is the fastest-growing application segment, fueled by rising global adoption of solar energy solutions and the need for efficient, high-quality wafer processing. Both applications reflect broader trends toward high-precision manufacturing and sustainable energy technologies.

Looking forward, the wafer grinding equipment market forecast indicates strong long-term growth driven by continuous innovation, increasing automation, and expanding demand for advanced wafers. Future market trends are expected to focus on higher precision, improved throughput, and integration with smart manufacturing systems, positioning wafer grinding equipment as a key enabler of next-generation semiconductor and photovoltaic technologies.

by Type

• Wafer Edge Grinder
• Wafer Surface Grinder

by Application

• Semiconductor
• Photovoltaic

By Company

Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation

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This release was published on openPR.