Press release
High-Performance HDI and Flex PCB Manufacturer | Jinsung Electronics
Key Features of Rigid-Flex & HDI PCB Solutions:
Rigid-flex structures offer up to 20 layers, making them ideal for compact systems, supporting sequential layer buildup with advanced stacking technology.
The integration of rigid and flexible sections in 3D circuits creates dynamic, bendable circuits, reducing the need for connectors and cables.
The flexible areas of the device can withstand up to 150,000 bending cycles, making it ideal for wearables and foldable devices.
The device supports laser-drilled vias as small as 0.1 mm, allowing ultra-dense BGA routing and fine-pitch layouts down to 0.4 mm.
Miniaturization and space optimization involve eliminating FOB areas, allowing internal space for larger batteries or slimmer bezels.
Embedding Technology (EPS/EDS) enables the integration of active/passive components within layers, enhancing performance and board thinning.
HDI technology provides superior electrical and thermal performance, enhancing signal integrity, EMI/RFI protection, and reliability.
The design capability for a single sideboard type is limited to a minimum pattern width/space of 45 μm and a thickness of 0.05T.
The double side should have a minimum width of 50 inches per space and a thickness of 0.11 inches.
The HDI/rigid-flex multilayer is a versatile material with a total thickness of 0.25T-3.0T, offering support for laser and machine drilling.
If you are looking for a Korean HDI PCB manufacturer, you can find them at Jinsung Electronics.
Click here if you are interested in Jinsung Electronics products.
View more: High-Performance HDI and Flex PCB Manufacturer.
Jinsung Electronics
Jinsung Electronics, is revolutionizing the electronics industry with its advanced FPC and rigid-flex circuit board design.
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