Global Advanced Packaging Technologies Market Projected to Grow at 14.9% CAGR, Reaching $14.22 Billion by 2029

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How Large Will the Advanced Packaging Technologies Market Size By 2025?
The market for advanced packaging technologies has seen a swift expansion in recent years. With a growth trajectory predicted to rise from $7.24 billion in 2024 to $8.16 billion in 2025, this reflects a compound annual growth rate (CAGR) of 12.6%. Factors such as the growth in the consumer electronics sector, mobile computing, improved thermal management, automotive electronics, and environmental considerations have contributed to this surge during the historical period.

How Big Is the Advanced Packaging Technologies Market Size Expected to Grow by 2029?
The market size for advanced packaging technologies is set to experience a swift expansion in the upcoming years, with projections showing it will reach a value of $14.22 billion in 2029, growing at a compound annual growth rate (CAGR) of 14.9%. Factors contributing to this growth in the forecast period encompass heterogeneous integration, quantum computing, flexible and stretchable electronics, supply chain resilience, and smart manufacturing. Key trends for this same period include advancements in interconnect technologies, fan-out wafer-level packaging, system-in-package, thermal management solutions, and embedded packaging for IoT devices.

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Which Key Market Drivers Powering Advanced Packaging Technologies Market Expansion and Growth?
The rising need for consumer electronics is set to fuel the expansion of the advanced packaging market in the future. Consumer electronics includes any electronic tools, gadgets, or devices designed for non-commercial or professional usage by consumers on a frequent basis. The sophistication of these products is significantly influenced by advanced packaging, thereby creating a demand. For example, the Japan Electronics and Information Technology Industries Association reported in May 2023 that Japan's electronic equipment output totaled 771,457 units. During the same period, consumer electronics production escalated to 32,099 units from 25,268 units in the preceding year, May 2022. This increasing demand for consumer electronics, hence, drives progress in the advanced packaging market.

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Which Fast-Growing Trends Are Poised to Disrupt the Advanced Packaging Technologies Market?
In the advanced packaging technologies sector, leading companies are investing their resources into the creation of new technological solutions for advanced packaging to boost their dominance in semiconductor solutions. These technological solutions consist of using novel methods, materials, and tools to enhance the effectiveness of packaging, safeguard products, and boost functionality, usually through intelligent features, automation, and improved sustainability. For example, ASE Group from Taiwan, a semiconductor engineering company, unveiled the Integrated Design Ecosystem in October 2023. This development decreases the cycle time by fifty percent by allowing more efficient silicon package design. Further, it fosters collaboration and optimization throughout the design process, making for speedier iterations and fortified performance in advanced packaging solutions. This progress aligns with the rising need for high-density packaging in domains such as artificial intelligence (AI), high-performance computing, and data centers.

What Are the Emerging Segments in the Advanced Packaging Technologies Market?
The advanced packaging technologies market covered in this report is segmented -

1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Other Types
2) By Product: Active Packaging, Smart And Intelligent Packaging
3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Other End Use Industries

Subsegments:
1) By 3D Integrated Circuit: Through-Silicon Vias (TSVs), Monolithic 3D ICs
2) By 2D Integrated Circuit: Flat Packaging, Chip-on-Board (CoB)
3) By 2.5D Integrated Circuit: Interposer-Based Packaging, Silicon Bridge Technologies
4) By Other Types: Fan-Out Wafer Level Packaging (FOWLP), System-in-Package (SiP), Multi-Chip Modules (MCM)

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Who Are the Global Leaders in the Advanced Packaging Technologies Market?
Major companies operating in the advanced packaging technologies market include Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SÜSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems

Which are the Top Profitable Regional Markets for the Advanced Packaging Technologies Industry?
Asia-Pacific was the largest region in global advanced packaging technologies market in 2024. The regions covered in the advanced packaging technologies market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

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