Surging Demand For Consumer Electronics To Drive Market Growth: A Key Catalyst Accelerating 3D IC And 2.5D IC Packaging Market Growth in 2025

Use code ONLINE30 to get 30% off on global market reports and stay ahead of tariff changes, macro trends, and global economic shifts.

3D IC And 2.5D IC Packaging Market Size Valuation Forecast: What Will the Market Be Worth by 2025?
In the past few years, the market size for 3D IC And 2.5D IC packaging has seen a swift growth. The projections show an increase from $53.51 billion in 2024 to about $59.28 billion in 2025, with a compound annual growth rate (CAGR) of 10.8%. This growth during the historical period is accredited to the shrinking size of electronic devices, the need for enhanced power efficiency, improved signal integrity demands, and the rising demand for consumer electronics and gaming devices, all contributing to improvement in performance.

3D IC And 2.5D IC Packaging Market Size Forecast: What's the Projected Valuation by 2029?
The market for 3D IC And 2.5D IC packaging is predicted to experience swift expansion in the upcoming years. It is projected to mature to a substantial $88.9 billion by 2029, with a compound annual growth rate (CAGR) of 10.7%. This growth spurt during the predictive phase can be credited to the rise of portable and wearable gadgets, the escalating requirement for energy efficiency, burgeoning demand for high-performance computing (HPC), and a shift toward system-on-chip (soc) designs. Also contributing to growth are growing complexity of semiconductor devices and the proliferation of IoT. The predictive phase is also expected to see trends such as advancements in 5G technology, development of interconnect technologies, collaboration and standardization within the industry, technological progress in semiconductor technology and innovations in packaging materials.

View the full report here:
https://www.thebusinessresearchcompany.com/report/3d-ic-and-2-5d-ic-packaging-global-market-report

What Are the Drivers Transforming the 3D IC And 2.5D IC Packaging Market?
The 3D IC And 2.5D IC packaging market is predicted to expand as a result of the escalating consumer electronics demand. The term "consumer electronics" encompasses any digital device intended for acquisition and use by end-users for personal, everyday, and non-commercial purposes. 3D IC (Integrated Circuit) and 2.5D IC packaging represent state-of-the-art packaging technologies facilitating improved performance, enhanced capability, and the miniaturization of electronic gadgets. A surge in consumer electronics and gaming devices demand is spurred by technology progression, rising disposable income, gaming industry growth, digital conversion, remote working, entertainment development, shifting lifestyle and likings, and the impact of social media and content intake. For example, LG, a consumer electronics corporation from South Korea reported in its 2022 annual financial report in January 2023, that sales in 2022 saw a growth of 12.9% compared to the preceding year, with sales exceeding about $52.70 billion. What's more, the LG Home Appliance & Air Solution Company also reported a landmark year with 2022 revenue reaching $22.5 billion, signifying a 10.3% rise from the prior year. Thus, the burgeoning demand for consumer electronics is propelling the ascent of the 3D IC And 2.5D IC packaging market.

Get your free sample here:
https://www.thebusinessresearchcompany.com/sample.aspx?id=12128&type=smp

What Long-Term Trends Will Define the Future of the 3D IC And 2.5D IC Packaging Market?
Cutting-edge technological developments are increasingly shaping the direction of the 3D IC And 2.5D IC packaging market, emerging as a significant trend. Many big brands in the 3D IC And 2.5D IC packaging market space are resorting to the adoption of these advancements to retain their market dominance. To highlight, ASE Technology Holding Co. Ltd., a semiconductor manufacturing service firm hailing from Taiwan, rolled out VIPack in June 2022. This pioneering packaging platform aims at providing vertically assimilated package solutions. VIPack signifies the subsequent phase of 3D heterogeneous integration architecture by ASE, which widens design instructions and ensures exceptional performance and density. Through this platform, companies can attain an unmatched level of creativity in integrating multiple chips into a single consolidated package. It incorporates advanced redistribution layer (RDL) technologies, 2.5D and 3D technologies, and embedded integration. ASE's VIPack is consolidated by six core packaging technology elements, supplemented by an expansive co-design ecosystem. These elements constitute ASE's high-density Silicon Via (TSV)-based 2.5D and 3D IC, Co-Packaged Optics processing power, and processing abilities for Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP).

Which Segments in the 3D IC And 2.5D IC Packaging Market Offer the Most Profit Potential?
The 3D IC and 2.5D IC packaging market covered in this report is segmented -

1) By Technology: 3D Wafer-Level Chip-Scale Packaging, 3D TSV (Through-Silicon Via), 2.5D
2) By Application: Logic, Memory, Imaging And Optoelectronics, MEMS Or Sensors, LED, Other Applications
3) By End-User: Telecommunication, Consumer Electronics, Automotive, Military And Aerospace, Medical Devices, Smart Technologies, Other End Users

Subsegments:
1) By 3D Wafer-Level Chip-Scale Packaging (WLCSP): Direct Chip Attach, Wafer-Level Packaging (WLP)
2) By 3D TSV (Through-Silicon Via): Interposer-Based TSV, Stacked Die TSV
3) By 2.5D: Active Interposers

Tailor your insights and customize the full report here:
https://www.thebusinessresearchcompany.com/customise?id=12128&type=smp

Which Firms Dominate the 3D IC And 2.5D IC Packaging Market by Market Share and Revenue in 2025?
Major companies operating in the 3D IC and 2.5D IC packaging market include Samsung Electronics Co. Ltd., Siemens AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Limited, SK Hynix Inc., Broadcom Inc., Fujitsu Limited, Toshiba Corporation, ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, STMicroelectronics NV, Infineon Technologies AG, Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Unimicron Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Cadence Design Systems Inc., Siliconware Precision Industries Co. Ltd., Powertech Technology Inc., Ansys Inc., STATS ChipPAC Pte. Ltd., Synopsys Inc, UTAC Holdings Ltd., Tessolve Semiconductor Private Limited, Invensas Corporation, National Center for Advanced Packaging Co. Ltd., Tohoku-MicroTec Co. Ltd, TechSearch International Inc.

Which Regions Offer the Highest Growth Potential in the 3D IC And 2.5D IC Packaging Market?
Asia-Pacific was the largest region in the 3D IC And 2.5D IC market in 2024. It is expected to be the fastest-growing region in the forecast period. The regions covered in the 3D IC And 2.5D IC packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

Purchase the full report today:
https://www.thebusinessresearchcompany.com/purchaseoptions.aspx?id=12128

This Report Supports:
1. Business Leaders & Investors - To identify growth opportunities, assess risks, and guide strategic decisions.
2. Manufacturers & Suppliers - To understand market trends, customer demand, and competitive positioning.
3. Policy Makers & Regulators - To track industry developments and align regulatory frameworks.
4. Consultants & Analysts - To support market entry, expansion strategies, and client advisory work.

Connect with us on:
LinkedIn: https://in.linkedin.com/company/the-business-research-company,
Twitter: https://twitter.com/tbrc_info,
YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ.

Contact Us
Europe: +44 7882 955267,
Asia: +91 88972 63534,
Americas: +1 310-496-7795 or
Email: mailto:info@tbrc.info

Learn More About The Business Research Company
With over 15,000+ reports from 27 industries covering 60+ geographies, The Business Research Company has built a reputation for offering comprehensive, data-rich research and insights. Our flagship product, the Global Market Model delivers comprehensive and updated forecasts to support informed decision-making.

This release was published on openPR.