Press release
Organic Substrate Packaging Material Industry Outlook 2025-2029: Market Set to Cross $19.89 Billion Milestone
Organic Substrate Packaging Material
How Large Will the Organic Substrate Packaging Material Market Size By 2025?
The market for organic substrate packaging materials has seen robust growth in the past few years. It is predicted to increase from a value of $14.9 billion in 2024 to $15.65 billion in 2025, demonstrating a Compound Annual Growth Rate (CAGR) of 5.0%. This growth during the historic period is primarily due to factors such as rising consumer electronics demand, environmental issues, regulatory policies, market rivalry, and worldwide economic movements.
How Big Is the Organic Substrate Packaging Material Market Size Expected to Grow by 2029?
The market size of organic substrate packaging material is anticipated to witness considerable expansion in the coming years, with predictions indicating a substantial increase to $19.9 billion in 2029 backed by a steady compound annual growth rate (CAGR) of 6.2%. Factors contributing to this growth over the forecast period range from the burgeoning electric vehicle industry, initiatives focusing on a circular economy, stringent environmental laws, rising trends in consumer electronics, to supply chain resilience. During the forecast period, notable trends will comprise the incorporation of nanotechnology into packaging, extending applications in the healthcare sector, innovative developments in material constitution, a surge in demand for high-performance yet cost-efficient solutions, and the emergence of next-generation technologies.
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Which Key Market Drivers Powering Organic Substrate Packaging Material Market Expansion and Growth?
The gradual rise in the usage of autonomous vehicles is projected to boost the growth of the organic substrate packaging material market. Autonomous cars, which are vehicles that can sense their environment and run without any human interaction, need semiconductors for processing and interpreting the data gathered. This rise in semiconductor usage will consequently cause a surge in the demand for semiconductor packaging, thereby increasing the need for organic substrate packaging materials. For example, the US-based non-profit National Association of Insurance Commissioners indicated in December 2022 that there are projected to be about 3.5 million self-driving cars on American roads by 2025, growing to 4.5 million by 2030. Hence, this surge in the use of autonomous vehicles is fuelling the growth of the organic substrate packaging material market.
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Which Fast-Growing Trends Are Poised to Disrupt the Organic Substrate Packaging Material Market?
Leading corporations in the organic substrate packaging sector are concentrating their efforts on creating cutting-edge products like high-reliability coreless organic interposers that increase performance in sophisticated semiconductor applications, boost thermal and electrical conductivity, and aid in the miniature trends of electronic devices, all while fulfilling the rising need for eco-friendly packaging solutions. A high-reliability coreless organic interposer is an advanced material used in high-tech electronic packaging, most notably in semiconductor devices. It is crafted to enable the link between various components of an integrated circuit (IC), providing improved performance and dependability. For instance, in June 2024, the Japan-based printing firm, TOPPAN Group, unveiled a high-reliability coreless organic interposer. This forward-thinking invention tackles the difficulties tied to the heterogeneous integration of semiconductors, an essential factor for propelling future semiconductor technologies. This development comes at a crucial time, with industries requiring more streamlined and effective semiconductor alternatives to drive emerging technology spheres such as AI, IoT, and automotive applications.
What Are the Emerging Segments in the Organic Substrate Packaging Material Market?
The organic substrate packaging material market covered in this report is segmented -
1) By Technology: Small Outline (SO) Packages, Grid Array (GA) Packages, Flat No-Leads Packages, Quad Flat Package (QFP), Dual In-Line Package (DIP), Other Technologies
2) By Application: Consumer Electronics, Automotive, Manufacturing, Healthcare, Other Applications
3) By End-Use: Mobile Phones, FPD (Flat Panel Display), Other End-Uses
Subsegments:
1) By Small Outline (SO) Packages: Small Outline Integrated Circuit (SOIC), Small Outline Transistor (SOT)
2) By Grid Array (GA) Packages: Ball Grid Array (BGA), Column Grid Array (CGA)
3) By Flat No-Leads Packages: Thin Profile No-Lead (TPNL) Packages, Quad No-Lead (QNL) Packages
4) By Quad Flat Package (QFP): Thin Quad Flat Package (TQFP), Low-Profile Quad Flat Package (LQFP)
5) By Dual In-Line Package (DIP): Standard DIP, Dual In-Line Memory Module (DIMM)
6) By Other Technologies: Chip-On-Board (COB), Embedded Wafer-Level Ball Grid Array (eWLB)
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Who Are the Global Leaders in the Organic Substrate Packaging Material Market?
Major companies operating in the organic substrate packaging material market are Amkor Technology Inc., Advanced Semiconductor Engineering Inc., Compass Technology Co. Ltd., Hitachi Chemical Company Ltd., Mitsubishi Corporation, STATS ChipPAC Pte Ltd., Shinko Electric Industries Co. Ltd., Showa Denko KK, Kyocera Corporation, WUS Printed Circuit Co. Ltd., Microchip Technology Inc., Texas Instruments Incorporated, Unimicron Technology Corporation, Ibiden Co. Ltd., AT&S Austria Technologie & Systemtechnik AG, Samsung Electro-Mechanics Co. Ltd., Amcor PLC, Fujikura Ltd., Nippon Mektron Ltd., Tripod Technology Corporation, Compeq Manufacturing Co. Ltd., HannStar Board Corporation, Kingboard Chemical Holdings Ltd., Sumitomo Bakelite Co. Ltd., Panasonic Corporation, Nitto Denko Corporation, Rogers Corporation, Shenzhen Kinwong Electronic Co. Ltd., Unitech Printed Circuit Board Corporation, Young Poong Electronics Co. Ltd., CMK Corporation, Daeduck GDS Co. Ltd., Dynamic Electronics Co. Ltd., Flexium Interconnect Inc., Fujitsu Interconnect Technologies Ltd., Interflex Co. Ltd., LG Innotek Co. Ltd., Multek Corporation
Which are the Top Profitable Regional Markets for the Organic Substrate Packaging Material Industry?
Asia-Pacific was the largest region in the organic substrate packaging material market share in 2024. North America was the second-largest region in the organic substrate packaging material market. The regions covered in the organic substrate packaging material market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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