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The Impact Of Surging IoT Demand On Molded Interconnect Devices Market: Critical Driver Shaping the Molded Interconnect Device (MID) Market in 2025
Molded Interconnect Device (MID)
Molded Interconnect Device (MID) Market Size Valuation Forecast: What Will the Market Be Worth by 2025?
In recent times, the market size for the molded interconnect device (MID) has seen a swift expansion. The market is projected to escalate from $1.75 billion in 2024 to $2.03 billion in 2025, growing at a compound annual growth rate (CAGR) of 16.4%. The historical growth has been influenced by factors such as trends in miniaturization, advancement in consumer electronics, evolution in automotive electronics, breakthroughs in medical device technology, and a transition towards intelligent manufacturing.
Molded Interconnect Device (MID) Market Size Forecast: What's the Projected Valuation by 2029?
In the next few years, the market for molded interconnect devices (MID) is set to experience a substantial increase, with predictions putting it at a worth of $3.7 billion by 2029. This equates to a compound annual growth rate (CAGR) of 16.2%. The projected growth over this period is due to a variety of factors, including the continuing advancement of consumer electronics, the increasing integration of medical devices, the expansion of the automotive electronics sector, and advancements in rapid prototyping and manufacturing. Key expected trends over this forecast period are regulatory compliance and quality standards, customization and design flexibility, rapid prototyping and manufacturing technologies, sustainability and material innovations, as well as industry 4.0 and smart manufacturing.
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What Are the Drivers Transforming the Molded Interconnect Device (MID) Market?
The escalating demand for devices connected to the Internet of Things (IoT) is forecasted to boost expansion of the molded interconnect devices market in the future. IoT devices are a vast range of physical objects connected to the internet which gather and share data with other devices and systems via the internet. An enhanced requirement for the Internet of Things, quantum computing, 5G and other nascent technology segments in conjunction with an increasing need for better computational speed and efficiency, low-powered devices, and intelligent microchips in a connected world has powerfully influenced dynamics within the semiconductor and electronics industry. For instance, August 2022 data from a Techjury blog, gathered from IoT Analytics, highlighted that the sectors with the greatest number of actual corporate IoT projects being developed were Smart City (23%), Connected Industry (17%), and Connected Building (12%), and 97% of firms found creating value from related IoT data to present challenges. Consequently, the progressing demand for IoT devices is expected to fuel the market for molded interconnect devices.
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What Long-Term Trends Will Define the Future of the Molded Interconnect Device (MID) Market?
The growth of technological advancements is a major trend observed in the molded interconnect device sector. Large enterprises dealing with molded connection devices are focusing on introducing innovative technology solutions that have versatility. This is contributing to the advancement of technologies such as laser plastic welding. For instance, in April 2022, SABIC, a chemical firm based in Saudi Arabia known for the production of chemicals, plastics, agri-nutrients, and metals, unveiled the LNP THERMOCOMP OFC08V compound. This compound, which plays a crucial role in 5G base station dipole antennae and various other electrical and electronic applications, is a high-performance solution. It is a glass fiber-reinforced substance made of polyphenylene sulfide (PPS) resin, developed to facilitate the development of all-plastic antenna designs that are lightweight and cost-effective. It showcases outstanding performance in laser direct structuring (LDS) plating and offers excellent layer adhesion, efficient warpage control, as well as consistent dielectric and radio frequency (RF) features.
Which Segments in the Molded Interconnect Device (MID) Market Offer the Most Profit Potential?
The molded interconnect device (MID) market covered in this report is segmented -
1) By Product: Antenna And Connectivity Modules, Connectors And Switches, Sensors, Lighting
2) By Process: Laser Direct Structuring (LDS), Two-Shot Molding, Other Processes
3) By Application: Automotive, Consumer Products, Healthcare, Industrial, Military And Aerospace, Telecommunication And Computing
Subsegments:
1) By Antenna And Connectivity Modules: Integrated Antennas, RF Modules
2) By Connectors And Switches: Electrical Connectors, Mechanical Switches
3) By Sensors: Temperature Sensors, Pressure Sensors, Proximity Sensors
4) By Lighting: LED Lighting Modules, Decorative Lighting Solutions
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Which Firms Dominate the Molded Interconnect Device (MID) Market by Market Share and Revenue in 2025?
Major companies operating in the molded interconnect device (MID) market are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG
Which Regions Offer the Highest Growth Potential in the Molded Interconnect Device (MID) Market?
Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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