Molded Interconnect Substrate (MIS) Market Forecast Driven by Miniaturization and Smart Device Integration | Valuates Reports

Molded Interconnect Substrate (MIS) Market Size
The global market for Molded Interconnect Substrate (MIS) was valued at US$ 98 million in the year 2024 and is projected to reach a revised size of US$ 228 million by 2031, growing at a CAGR of 12.2% during the forecast period.

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The molded interconnect substrate (MIS) market is experiencing robust market growth, propelled by the increasing demand for compact, multifunctional electronic components across automotive, industrial, and consumer device sectors. MIS technology enables the seamless embedding of circuitry into three-dimensional thermoplastic structures, supporting miniaturization, system integration, and reduced assembly costs.

Market size is expanding as manufacturers shift toward design consolidation, eliminating multiple assembly steps by creating structural and electrical functions within single MIS components. Applications in wearable sensors, IoT modules, medical devices, and automotive electronics are particularly benefiting from the lightweight and space-efficient profiles that MIS offers.

Market trends reveal a rise in hybrid manufacturing processes combining injection molding, laser direct structuring, and selective metallization. These trends support higher interconnect density and rapid prototyping for electronics integration. Sustainability efforts are also emerging, with recyclable substrate materials and eco-friendly metallization techniques being increasingly adopted, reflecting the industry's shift toward circular economy outcomes.

Market share is shaped by specialist MIS providers and high-performance thermoplastic material producers. Strategic collaborations with OEMs and electronics integrators are positioning these suppliers to capitalize on early adoption in next-generation electronic platforms. Their portfolios are expanding through the introduction of application-specific MIS components tailored to optical sensors, antenna modules, and embedded circuitry solutions, giving them a competitive edge.

The market forecast remains positive. As device miniaturization accelerates and systems demand higher integration with reduced weight and improved reliability, adoption of MIS technology is expected to grow. Markets such as automotive electrification, wearable electronics, and smart factories will drive further investment in MIS capabilities and manufacturing infrastructure.

In conclusion, the molded interconnect substrate market is poised for sustained expansion. With a growing market size, evolving market trends centered on integration and sustainability, increasing market share dynamics, and a favorable market forecast, MIS is shaping the future of compact, embedded electronics design.

by Type
• 1 Layer MIS Substrate
• 2 Layer MIS Substrate
• 3 Layer MIS Substrate
• 4 Layer MIS Substrate
• 6 Layer MIS Substrate
• Others

by Application

• Analog Chip
• Power IC
• RF/5G
• Fingerprint Sensor
• OIS (Optical Image Stablization)
• Others

By Company

PPt, MiSpak Technology, QDOS

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This release was published on openPR.