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Photosensitive Polyimide Market for Semiconductors to Surpass USD 1 Billion by 2031, Fueled by Advanced Lithography and High-Density Chip Design
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PSPI offers a rare combination of thermal resistance, fine photopatterning, and chemical compatibility, making it a preferred material in advanced semiconductor packaging, logic fabrication, and wafer-level processing. It plays a crucial role in interlayer insulation, passivation, and multilayer redistribution line (RDL) creation.
Photosensitive polyimides are enabling the ultra-fine geometries and stacked structures required for today's most advanced chips," said a CVMI semiconductor analyst. "They're not just materials-they're enablers of 3D silicon architecture.
Industry leaders such as Toray, Fujifilm, DuPont, and Hitachi Chemical are improving PSPI resolution, controlling thermal expansion, and integrating with EUV-compatible resists. Applications include logic ICs, DRAM, CMOS sensors, and RF modules, all of which require ultra-clean and reliable dielectric solutions.
Asia-Pacific remains the global production hub for PSPI in semiconductors, while North America and Europe lead in node R&D and specialty semiconductor markets such as automotive and image sensing.
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Photosensitive Polyimide (PSPI) is a type of polymer that is photosensitive, meaning it can undergo chemical changes when exposed to light. This material is widely used in the electronics industry for applications such as flexible printed circuits, flexible displays, and semiconductor packaging due to its excellent thermal stability, chemical resistance, and low dielectric constant.
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Photosensitive Polyimide (PSPI) Market
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The Internet of Things (IoT), wearable technology, smartphones, and tablets are the main drivers of the electronics industry's explosive expansion. These gadgets require parts that are more…
