Glass Core Substrates Market Forecast Driven by High-Frequency Electronics and Thermal Performance Demands | Valuates Reports

Glass Core Substrates Market Size
The global market for Glass Core Substrates was valued at US$ 213 million in the year 2024 and is projected to reach a revised size of US$ 586 million by 2031, growing at a CAGR of 15.7% during the forecast period.

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The glass core substrates market is witnessing notable expansion, bolstered by increasing demand in advanced electronics and telecommunications infrastructure. These substrates, valued for their superior thermal stability, low signal loss, and mechanical rigidity, are essential components in high-frequency and high-reliability devices such as 5G telecom equipment, aerospace electronics, and sophisticated radar systems.

Market size is growing as manufacturers and system integrators prioritize performance and durability. Glass core substrates are increasingly preferred over traditional FR 4 and organic materials due to their ability to support higher operating frequencies and thermal endurance. This is driving their adoption in radar arrays, phased antennas, and mission-critical communication hardware.

Market trends reflect a shift toward multilayer and mixed-material laminate solutions that combine glass cores with advanced dielectric films. Demand is rising for substrates that support miniaturization while maintaining signal integrity, enabling the integration of compact, high-density circuits. Furthermore, the growth in telecom infrastructure, especially 5G deployments and next-generation wireless backhaul systems, continues to expand the use of glass core technology.

In terms of market share, specialized laminate manufacturers with capabilities in high-precision fabrication are gaining prominence. These vendors are strengthening their positions through partnerships with electronics OEMs, investing in cleanroom production lines and advanced drill and bonding processes to meet performance requirements. Regional growth is evident in Asia-Pacific, where electronics consumption and telecom infrastructure investment remain strong, while North America and Europe also report growing demand in defense and aerospace sectors.

The market forecast remains optimistic, with steady market growth expected in the coming years. Continued expansion in 5G rollouts, aerospace modernization, and improvements in automotive radar systems will increase demand for high-performance substrates. Innovation in hybrid material systems and manufacturing scale-up will likely reinforce market growth.

In conclusion, the glass core substrates market is poised for sustained expansion. Increasing market size, evolving market trends toward advanced electronic applications, and a supportive market forecast reflect the technology's critical role in enabling high-frequency, high-temperature, and high-reliability electronics across multiple industries.

by Type

• Coefficient of Thermal Expansion (CTE), above 5 ppm/°C
• Coefficient of Thermal Expansion (CTE), below 5 ppm/°C

by Application
• Wafer Level Packaging
• Panel Level Packaging

By Company

AGC, Schott, Corning, Hoya, Ohara, Dai Nippon Printing (DNP), NEG, CrysTop Glass, WGTech

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