Advanced Packaging Inspection and Metrology Equipment Market to Hit USD 1530 Million by 2031, Driven by AI and Semiconductor Innovation

Advanced Packaging Inspection and Metrology Equipment Market Size

The global market for Advanced Packaging Inspection and Metrology Equipment was valued at US$ 817 million in the year 2024 and is projected to reach a revised size of US$ 1530 million by 2031, growing at a CAGR of 9.5% during the forecast period.

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The world's core manufacturers of Advanced Packaging Inspection and Metrology Equipment include Camtek, ONTO and LaserTec. The top three companies have a market share of about 60%. Asia Pacific is the world's largest market for Advanced Packaging Inspection and Metrology Equipment with a market share of approximately 89%, followed by North America and Europe with a market share of 7% and 3%, respectively. In terms of applications, OSAT is the largest downstream segment, accounting for about 59% of the market.

By Type
• Fan out RDL I&M
• 3D HBM Memory Stacking I&M
• Hybrid Bonding I&M
• Wafer Manufacturing I&M
• Front-end Applications

By Application
• OSAT
• IDM and Foundry

Key Companies
KLA-Tencor, LaserTec, Unity SC, ONTO, Camtek, Confovis, Nova, Bruker, Nearfield Instruments

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This release was published on openPR.