Global Epoxy Resin Encapsulation Glue for IC Packaging Market Set to Surge by 2025: Key Trends, Growth Forecasts, and Competitive Insights

LOS ANGELES, United States: QY Research has recently published a report, titled "Global Epoxy Resin Encapsulation Glue for IC Packaging Market Research Report 2025". The report on the global Epoxy Resin Encapsulation Glue for IC Packaging market has been prepared by experienced and knowledgeable market analysts and researchers. It is a phenomenal compilation of important studies that explore the competitive landscape, segmentation, geographical expansion, and revenue, production, and consumption growth of the global Epoxy Resin Encapsulation Glue for IC Packaging market. Players can use the accurate market facts and figures and statistical studies provided in the report to understand the current and future growth of the global Epoxy Resin Encapsulation Glue for IC Packaging market.

The global market for Epoxy Resin Encapsulation Glue for IC Packaging was valued at US$ 552 million in the year 2024 and is projected to reach a revised size of US$ 1674 million by 2031, growing at a CAGR of 17.2% during the forecast period.

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Our analysts have used advanced primary and secondary research techniques and tools to compile this report. The research sources and tools that we use are highly reliable and trustworthy. The report offers effective guidelines and recommendations for players to secure a position of strength in the global Epoxy Resin Encapsulation Glue for IC Packaging market. New players can also use this research study to create business strategies and get informed about future market challenges.

Our competitor profiling includes evaluation of distribution channels and products and services offered by and financial performance of companies operating in the global Epoxy Resin Encapsulation Glue for IC Packaging market. We also provide Porter's Five Forces, PESTLE, and SWOT analysis to assess competitive threat and examine other aspects of the global Epoxy Resin Encapsulation Glue for IC Packaging market. The report offers strategic recommendations, competitor benchmarking for performance measurement, and analysis of partnership, merger, and acquisition targets and industry best practices.

Details of Epoxy Resin Encapsulation Glue for IC Packaging Market Segmentation: -

Segment by Key Manufacturers:

3M
Henkel
Parker LORD
SolEpoxy
Epic Resins
Robnor ResinLab
Guangdong Anders Industrial Co., Ltd.
Shantou Niche-Tech Kaiser Co., Ltd.
Dongguan Huachuang Electronic Materials Co., Ltd.
Guangdong Wanmu New Material Technology Co., Ltd.
Beijing Kmt Technology Co., Ltd
Yongdeji Technology (Suzhou) Co., Ltd.
Shanghai Dodi Polymer Material Co., Ltd.
Hubei Huitian New Materials Co., Ltd.
Dongguan Sains Industrial Co., Ltd.

Segment by Type

One-component
Two-component

Segment by Application

Consumer Electronics
Computers and Data Centers
Automotive Electronics
Medical Electronics
Industrial
Others

The research study includes key results and findings of our monitoring and analysis of the global Epoxy Resin Encapsulation Glue for IC Packaging market. We have provided crucial data points, which include divestments, new product launches, expansions, partnerships, mergers, acquisitions, and other strategic initiatives taken by players in the global Epoxy Resin Encapsulation Glue for IC Packaging market. The report also provides price trends for regional markets and analysis of important market events on a regional as well as global scale.

The report will help you to understand how and whether or not the global Epoxy Resin Encapsulation Glue for IC Packaging market has become customer-centric. It offers deep insights into customer needs and preferences for players to increase their brand value, better connect with their clients, and improve their sales in the global Epoxy Resin Encapsulation Glue for IC Packaging market.

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Table of Contents

1 Epoxy Resin Encapsulation Glue for IC Packaging Market Overview
1.1 Product Definition
1.2 Epoxy Resin Encapsulation Glue for IC Packaging by Type
1.2.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 One-component
1.2.3 Two-component
1.3 Epoxy Resin Encapsulation Glue for IC Packaging by Application
1.3.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Computers and Data Centers
1.3.4 Automotive Electronics
1.3.5 Medical Electronics
1.3.6 Industrial
1.3.7 Others
1.4 Global Market Growth Prospects
1.4.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Estimates and Forecasts (2020-2031)
1.4.4 Global Epoxy Resin Encapsulation Glue for IC Packaging Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations

2 Market Competition by Manufacturers
2.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Market Share by Manufacturers (2020-2025)
2.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Epoxy Resin Encapsulation Glue for IC Packaging, Industry Ranking, 2023 VS 2024
2.4 Global Epoxy Resin Encapsulation Glue for IC Packaging Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Epoxy Resin Encapsulation Glue for IC Packaging Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Epoxy Resin Encapsulation Glue for IC Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Epoxy Resin Encapsulation Glue for IC Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Epoxy Resin Encapsulation Glue for IC Packaging, Date of Enter into This Industry
2.9 Epoxy Resin Encapsulation Glue for IC Packaging Market Competitive Situation and Trends
2.9.1 Epoxy Resin Encapsulation Glue for IC Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Epoxy Resin Encapsulation Glue for IC Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion

3 Epoxy Resin Encapsulation Glue for IC Packaging Production by Region
3.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value by Region (2020-2031)
3.2.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Epoxy Resin Encapsulation Glue for IC Packaging by Region (2026-2031)
3.3 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Volume by Region (2020-2031)
3.4.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Epoxy Resin Encapsulation Glue for IC Packaging by Region (2026-2031)
3.5 Global Epoxy Resin Encapsulation Glue for IC Packaging Market Price Analysis by Region (2020-2025)
3.6 Global Epoxy Resin Encapsulation Glue for IC Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Epoxy Resin Encapsulation Glue for IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Epoxy Resin Encapsulation Glue for IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Epoxy Resin Encapsulation Glue for IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Epoxy Resin Encapsulation Glue for IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.5 India Epoxy Resin Encapsulation Glue for IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.6 Southeast Asia Epoxy Resin Encapsulation Glue for IC Packaging Production Value Estimates and Forecasts (2020-2031)

4 Epoxy Resin Encapsulation Glue for IC Packaging Consumption by Region
4.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Consumption by Region (2020-2031)
4.2.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Consumption by Region (2020-2025)
4.2.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Epoxy Resin Encapsulation Glue for IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Epoxy Resin Encapsulation Glue for IC Packaging Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Epoxy Resin Encapsulation Glue for IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Epoxy Resin Encapsulation Glue for IC Packaging Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Epoxy Resin Encapsulation Glue for IC Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Epoxy Resin Encapsulation Glue for IC Packaging Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Epoxy Resin Encapsulation Glue for IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Epoxy Resin Encapsulation Glue for IC Packaging Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries

5 Segment by Type
5.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production by Type (2020-2031)
5.1.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production by Type (2020-2025)
5.1.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production by Type (2026-2031)
5.1.3 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Market Share by Type (2020-2031)
5.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value by Type (2020-2031)
5.2.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value by Type (2020-2025)
5.2.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value by Type (2026-2031)
5.2.3 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value Market Share by Type (2020-2031)
5.3 Global Epoxy Resin Encapsulation Glue for IC Packaging Price by Type (2020-2031)

6 Segment by Application
6.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production by Application (2020-2031)
6.1.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production by Application (2020-2025)
6.1.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production by Application (2026-2031)
6.1.3 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Market Share by Application (2020-2031)
6.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value by Application (2020-2031)
6.2.1 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value by Application (2020-2025)
6.2.2 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value by Application (2026-2031)
6.2.3 Global Epoxy Resin Encapsulation Glue for IC Packaging Production Value Market Share by Application (2020-2031)
6.3 Global Epoxy Resin Encapsulation Glue for IC Packaging Price by Application (2020-2031)

7 Key Companies Profiled
7.1 3M
7.1.1 3M Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.1.2 3M Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.1.3 3M Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.1.4 3M Main Business and Markets Served
7.1.5 3M Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.2.2 Henkel Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.2.3 Henkel Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Henkel Main Business and Markets Served
7.2.5 Henkel Recent Developments/Updates
7.3 Parker LORD
7.3.1 Parker LORD Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.3.2 Parker LORD Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.3.3 Parker LORD Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Parker LORD Main Business and Markets Served
7.3.5 Parker LORD Recent Developments/Updates
7.4 SolEpoxy
7.4.1 SolEpoxy Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.4.2 SolEpoxy Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.4.3 SolEpoxy Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.4.4 SolEpoxy Main Business and Markets Served
7.4.5 SolEpoxy Recent Developments/Updates
7.5 Epic Resins
7.5.1 Epic Resins Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.5.2 Epic Resins Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.5.3 Epic Resins Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Epic Resins Main Business and Markets Served
7.5.5 Epic Resins Recent Developments/Updates
7.6 Robnor ResinLab
7.6.1 Robnor ResinLab Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.6.2 Robnor ResinLab Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.6.3 Robnor ResinLab Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Robnor ResinLab Main Business and Markets Served
7.6.5 Robnor ResinLab Recent Developments/Updates
7.7 Guangdong Anders Industrial Co., Ltd.
7.7.1 Guangdong Anders Industrial Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.7.2 Guangdong Anders Industrial Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.7.3 Guangdong Anders Industrial Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Guangdong Anders Industrial Co., Ltd. Main Business and Markets Served
7.7.5 Guangdong Anders Industrial Co., Ltd. Recent Developments/Updates
7.8 Shantou Niche-Tech Kaiser Co., Ltd.
7.8.1 Shantou Niche-Tech Kaiser Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.8.2 Shantou Niche-Tech Kaiser Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.8.3 Shantou Niche-Tech Kaiser Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Shantou Niche-Tech Kaiser Co., Ltd. Main Business and Markets Served
7.8.5 Shantou Niche-Tech Kaiser Co., Ltd. Recent Developments/Updates
7.9 Dongguan Huachuang Electronic Materials Co., Ltd.
7.9.1 Dongguan Huachuang Electronic Materials Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.9.2 Dongguan Huachuang Electronic Materials Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.9.3 Dongguan Huachuang Electronic Materials Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Dongguan Huachuang Electronic Materials Co., Ltd. Main Business and Markets Served
7.9.5 Dongguan Huachuang Electronic Materials Co., Ltd. Recent Developments/Updates
7.10 Guangdong Wanmu New Material Technology Co., Ltd.
7.10.1 Guangdong Wanmu New Material Technology Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.10.2 Guangdong Wanmu New Material Technology Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.10.3 Guangdong Wanmu New Material Technology Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Guangdong Wanmu New Material Technology Co., Ltd. Main Business and Markets Served
7.10.5 Guangdong Wanmu New Material Technology Co., Ltd. Recent Developments/Updates
7.11 Beijing Kmt Technology Co., Ltd
7.11.1 Beijing Kmt Technology Co., Ltd Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.11.2 Beijing Kmt Technology Co., Ltd Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.11.3 Beijing Kmt Technology Co., Ltd Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Beijing Kmt Technology Co., Ltd Main Business and Markets Served
7.11.5 Beijing Kmt Technology Co., Ltd Recent Developments/Updates
7.12 Yongdeji Technology (Suzhou) Co., Ltd.
7.12.1 Yongdeji Technology (Suzhou) Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.12.2 Yongdeji Technology (Suzhou) Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.12.3 Yongdeji Technology (Suzhou) Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Yongdeji Technology (Suzhou) Co., Ltd. Main Business and Markets Served
7.12.5 Yongdeji Technology (Suzhou) Co., Ltd. Recent Developments/Updates
7.13 Shanghai Dodi Polymer Material Co., Ltd.
7.13.1 Shanghai Dodi Polymer Material Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.13.2 Shanghai Dodi Polymer Material Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.13.3 Shanghai Dodi Polymer Material Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Shanghai Dodi Polymer Material Co., Ltd. Main Business and Markets Served
7.13.5 Shanghai Dodi Polymer Material Co., Ltd. Recent Developments/Updates
7.14 Hubei Huitian New Materials Co., Ltd.
7.14.1 Hubei Huitian New Materials Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.14.2 Hubei Huitian New Materials Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.14.3 Hubei Huitian New Materials Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Hubei Huitian New Materials Co., Ltd. Main Business and Markets Served
7.14.5 Hubei Huitian New Materials Co., Ltd. Recent Developments/Updates
7.15 Dongguan Sains Industrial Co., Ltd.
7.15.1 Dongguan Sains Industrial Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Company Information
7.15.2 Dongguan Sains Industrial Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Product Portfolio
7.15.3 Dongguan Sains Industrial Co., Ltd. Epoxy Resin Encapsulation Glue for IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Dongguan Sains Industrial Co., Ltd. Main Business and Markets Served
7.15.5 Dongguan Sains Industrial Co., Ltd. Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis
8.1 Epoxy Resin Encapsulation Glue for IC Packaging Industry Chain Analysis
8.2 Epoxy Resin Encapsulation Glue for IC Packaging Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Epoxy Resin Encapsulation Glue for IC Packaging Production Mode & Process Analysis
8.4 Epoxy Resin Encapsulation Glue for IC Packaging Sales and Marketing
8.4.1 Epoxy Resin Encapsulation Glue for IC Packaging Sales Channels
8.4.2 Epoxy Resin Encapsulation Glue for IC Packaging Distributors
8.5 Epoxy Resin Encapsulation Glue for IC Packaging Customer Analysis

9 Epoxy Resin Encapsulation Glue for IC Packaging Market Dynamics
9.1 Epoxy Resin Encapsulation Glue for IC Packaging Industry Trends
9.2 Epoxy Resin Encapsulation Glue for IC Packaging Market Drivers
9.3 Epoxy Resin Encapsulation Glue for IC Packaging Market Challenges
9.4 Epoxy Resin Encapsulation Glue for IC Packaging Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

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