Press release
Semiconductor FOUP and FOSB Market Set for Growth as Chip Production and Automation Accelerate
Semiconductor FOUP and FOSB Market SizeThe global market for Semiconductor FOUP and FOSB was valued at US$ 815 million in the year 2024 and is projected to reach a revised size of US$ 1304 million by 2031, growing at a CAGR of 7.0% during the forecast period.
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The major manufacturers of global semiconductor FOUP and FOSB wafer cassettes are Entegris, Shin-Etsu Polymer, Miraial, Chuang King Enterprise, Gudeng Precision, 3S Korea, Dainichi Shoji, etc. The top three manufacturers together occupy more than 85% of the market share, of which the largest producer is Entegris, with a market share of 54.08%. Global semiconductor FOUP and FOSB wafer box production regions are mainly located in North America, Japan and Taiwan (China), etc. The top three regions occupy more than 95% of the market share. In terms of their product categories, In-process wafer transport boxes(FOUP) have a higher market share of 73.55%, while shipment wafer transport boxe(FOSB) account for a lower share. In terms of its applications, 300mm wafers are its top application area with a 97.91% market share, while 200mm wafers account for a lower share.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor FOUP and FOSB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Wafer Size, and by regions.
By Type
• FOUP
• FOSB
By Water Size
• 300 mm Wafer
• 200 mm Wafer
Key Companies
Entegris, Shin-Etsu Polymer, Miraial, Chuang King Enterprise, Gudeng Precision, 3S Korea, Dainichi Shoji
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