Glass Substrate for Semiconductor Packaging Market to Hit USD 3085.2 Million by 2030 | AI, 5G, and IoT Drive Demand Surge

Glass Substrate for Semiconductor Packaging - Market Size

The global market for Glass Substrate for Semiconductor Packaging was estimated to be worth US$ 1220 million in 2023 and is forecast to a readjusted size of US$ 3085.2 million by 2030 with a CAGR of 12.4% during the forecast period 2024-2030.

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The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

By Type
• Cover Glass Substrate
• Back-grinding Glass Substrate
• Support Glass Substrate

By Application
• Wafer Level Packaging
• Panel Level Packaging

Key Companies
AGC, Vitrion, Corning Inc, NQW(Nano Quarz Wafer), Schott AG, Plan Optik AG, Tecnisco, LG Chem, Hoya Corporation, Ohara Corporation

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This release was published on openPR.