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Laser Assisted Bonder Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports
Laser Assisted Bonder Market SizeThe global market for Laser Assisted Bonder was valued at US$ 41.2 million in the year 2024 and is projected to reach a revised size of US$ 62.3 million by 2031, growing at a CAGR of 5.7% during the forecast period.
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A Laser Assisted Bonder is a device that utilizes laser technology to facilitate the bonding process between two surfaces, typically in the context of semiconductor packaging or microelectronics. This technology combines the precision and control of laser beams with the bonding mechanism to achieve high-quality, reliable connections.
North American market for Laser Assisted Bonder is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Laser Assisted Bonder is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Laser Assisted Bonder include PacTech, Mergenthaler, Finetech, Mi Equipment, MSI.Equipment, Protec, Chengdu LasTop Tech, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
By Type
• Transparent Substrate Materials
• Non-transparent Substrate Materials
By Application
• Chip on Submount (CoS)
• Chip to Chip (CoC)
• Chip on Wafer (C2W)
Key Companies
PacTech, Mergenthaler, Finetech, Mi Equipment, MSI.Equipment, Protec, Chengdu LasTop Tech
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