Wafer Level Packaging Global Market size is expected to reach $7.8 billion by 2022 and registering a CAGR of 21.5% from 2016‐2022

Research Beam added report on “World Wafer Level Packaging Market Overview, Analysis, Demand, Report, Trends, Growth and Research – Wafer Level Packaging Market by Integration Type (Fan-in WLP and Fan-out WLP), Packaging Technology (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and Others), Bumping Technology (Copper Pillar, Solder Bumping, Gold Bumping, and Others), Industry Vertical (Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defense, Healthcare, and Others) - Global Opportunity Analysis and Industry Forecast, 2014-2022”

Research Beam study says global wafer-level packaging market size is expected to reach $7.8 billion by 2022, registering a CAGR of 21.5% from 2016‐2022, Request Sample Copy @ http://www.researchbeam.com/wafer-level-packaging-market/request-sample

Wafer-level packaging (WLP) is used for interconnecting electronic components, such as resistors, capacitors, transistors, and others onto a single chip to make an integrated circuit, while utilizing deposited solder bumps onto the chip pads. WLP allows integration of wafer fabrication, packaging, test, and burn-in at wafer level to streamline the manufacturing process undertaken by a device. Use of WLP offers numerous advantages, such as multichip capability, increased I/O density, reduced form factor, improved electrical & mechanical performance, outstanding cost/performance capability, and opportunity for advanced 3D structures, over conventional packaging technologies such as chip scale packaging and wire-bond packaging.

The increase in demand for high-speed and compact size of electronic products has expanded the need for wafer-level packaging market. In addition, Internet of Things (IoT) has been gaining popularity, and is considered as the third wave of technology. The increasing popularity of IoT and portable electronics market is expected to foster the high growth of the wafer-level packaging industry. Moreover, WLP’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices acts as drivers of the market growth. However, encapsulation being a challenge for fan-out wafer-level packaging, and high initial investment functions as key constraints to the market. Growing demands of electronics market for faster, lighter, smaller, yet less expensive electronic packaging solutions with high performance acts as an opportunity for WLP market.

The demand for wafer-level packaging is expected to surge due to heavy investments on the R&D by many key players including Jiangsu Changjiang Electronics Technology Co. Ltd., Amkor Technology Inc.; and Fujitsu Ltd., leading to the improvement in packaging quality. For instance, in April 2016, Deca Technologies announced the signing of an agreement, whereas ASE intends to invest $60 million and license Deca’s M-Series fan-out WLP technologies and processes.

Global Wafer-Level Packaging Market Scenario
The fundamental properties of wafer-level packaging make it a favourable interconnection technology for several applications. The varied applications of IoT in industry verticals, such as IT & telecommunication, electronics, automotive, industrial, and healthcare, has generated interest of the wafer-level packaging. Fan-out WLP is expected to witness the highest growth in the wafer-level packaging industry as it provides ultra-high density interconnection and can integrate multiple heterogeneous dies in a cost-effective package along with superior electrical performance. However, the technology is limited to a narrow range of applications, essentially single die packages for cell phone baseband chips. Although, demand of mobile customers for miniaturization and higher integration, while keeping costs low, drives the fan-out WLP market.

Technological Superiority of Wafer Level Packaging Over Conventional Technologies
Technological advancement in electronic packaging has delivered highly efficient and reliable electrical interconnect solutions for electronic products, driving the demand for wafer-level packaging. It is extensively understood that wafer-level packaging offers a range of advantages as compared to customary chip-scale packaging and wire-bond packaging, including the superior thermal and electrical performance, substrate flexibility for varying performance requirements, proven construction, and well-established process equipment expertise. Moreover, WLP is cost-effective and an innovative process which generates interest among the electronic product customers and drives the packaging designers to maximize package performances.

KEY BENEFITS
Comprehensive analysis of the global wafer-level packaging market trends, both current and future estimations, are provided
The report offers a competitive scenario of the market and elucidates on the growth trends, driving factors, scope, opportunities, and challenges
The report includes a comprehensive analysis of the key segments to provide insights on the market dynamics
Porter’s Five Forces analysis highlights the potential of buyers and suppliers as well as provides insights on the competitive structure of the market to devise effective growth strategies and facilitate better decision-making
Value chain analysis provides key inputs on the role of stakeholders involved at various stages of the value chain

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