openPR Logo
Press release

Lucintel Forecasts the Global 3D TSV Package Market to Reach $21.9 billion by 2030

05-21-2025 09:50 PM CET | Business, Economy, Finances, Banking & Insurance

Press release from: ABNewswire

According to a market report by Lucintel, the future of the global 3D TSV package market looks promising with opportunities in the onsumer electronic, automotive, healthcare, and aerospace & defense market. The global 3D TSV package market is expected to

According to a market report by Lucintel, the future of the global 3D TSV package market looks promising with opportunities in the onsumer electronic, automotive, healthcare, and aerospace & defense market. The global 3D TSV package market is expected to

According to a market report by Lucintel, the future of the global 3D TSV package market looks promising with opportunities in the onsumer electronic, automotive, healthcare, and aerospace & defense market. The global 3D TSV package market is expected to reach an estimated $21.9 billion by 2030
According to a market report by Lucintel, the future of the global 3D TSV package market looks promising with opportunities in the onsumer electronic, automotive, healthcare, and aerospace & defense market. The global 3D TSV package market is expected to reach an estimated $21.9 billion by 2030 from $15.8 billion in 2024, at a CAGR of 9.1% from 2024 to 2030. The major drivers for this market are growing demand for high-performance and compact electronic devices, rapid adoption of 5G technology, and increasing demand for AI and ML technologies.

A more than 150-page report to understand trends, opportunity and forecast in 3D TSV package market to 2030 by technology (wafer level packaging and through silicon via), application (memory based application, logic based application,and mems & sensors), end use (consumer electronics, automotive, healthcare, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World).

Lucintel forecasts that, within the technology category, wafer-level packaging is expected to witness the highest growth over the forecast period.

Within the end use category, consumer electronics will remain the largest segment.

In terms of regions, North America is expected to witness highest growth over the forecast period.

Download sample by clicking on 3D TSV package market

Qualcomm, Intel, Advanced Micro Devices, Micron Technology, Stmicroelectronics, Infineon Technologies, Nxp Semiconductors, Asml, Dialog Semiconductor are the major suppliers in the 3D TSV package market.

This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or write us at helpdesk@lucintel.com To get access of more than 1000 reports at fraction of cost visit Lucintel's Analytics Dashboard.

About Lucintel

At Lucintel, we offer solutions for you growth through game changer ideas and robust market & unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times.

Contact: Roy Almaguer Lucintel Dallas, Texas, USA Email: roy.almaguer@lucintel.com Tel. +1-972-636-5056

Explore Our Latest Publications

Precast Concrete Market

PUR Hot-Melt Adhesive Market

Rust Lubricant Market

Sanding Block Market

Cold Laser Therapy Market

Media Contact
Company Name: Lucintel
Contact Person: Roy Almaguer
Email:Send Email [https://www.abnewswire.com/email_contact_us.php?pr=lucintel-forecasts-the-global-3d-tsv-package-market-to-reach-219-billion-by-2030]
Phone: 972.636.5056
Address:8951 Cypress Waters Blvd., Suite 160
City: Dallas
State: TEXAS
Country: United States
Website: https://www.lucintel.com/

Legal Disclaimer: Information contained on this page is provided by an independent third-party content provider. ABNewswire makes no warranties or responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you are affiliated with this article or have any complaints or copyright issues related to this article and would like it to be removed, please contact retract@swscontact.com



This release was published on openPR.

Permanent link to this press release:

Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.

You can edit or delete your press release Lucintel Forecasts the Global 3D TSV Package Market to Reach $21.9 billion by 2030 here

News-ID: 4029339 • Views:

More Releases from ABNewswire

Prolift Handling Brings Advanced pewag Lifting Technology to Ireland
Prolift Handling Brings Advanced pewag Lifting Technology to Ireland
Prolift Handling launches pewag levo Balancer and levo Compensator in Ireland - two advanced lifting solutions that improve safety and precision in heavy lifting operations through remote-controlled positioning and automatic load balancing. Dublin, Ireland - Sep 30, 2025 - Prolift Handling, Ireland's exclusive pewag partner, today launched two advanced lifting solutions designed to tackle the industry's most challenging safety and precision requirements: the pewag levo Balancer and pewag levo Compensator. The pewag
A Gem of Joy ABA Breaks Barriers to Access with In-Home Therapy Services for Families in Maryland
A Gem of Joy ABA Breaks Barriers to Access with In-Home Therapy Services for Fam …
A Gem of Joy ABA offers in-home therapy services for Maryland families, breaking barriers to access and providing personalized support for children's development. Maryland - A Gem of Joy ABA, a leading provider of autism therapy solutions, is making a transformative impact on families across Maryland by offering flexible and personalized in-home ABA Therapy. This innovative approach aims to break down barriers to care by delivering services directly to families' homes,
Ontario Therapy Takes Action to Break Mental Health Stigma with DBT Therapy in Bradford
Ontario Therapy Takes Action to Break Mental Health Stigma with DBT Therapy in B …
Ontario Therapy is expanding access to DBT therapy in Bradford, helping individuals overcome mental health challenges with effective, stigma-free support and coping strategies. Bradford, ON - Ontario Therapy is taking significant steps to combat the stigma surrounding mental health by expanding access to Dialectical Behavior Therapy (DBT) in Bradford. With a mission to create more inclusive and supportive mental health care environments, Ontario Therapy is offering DBT therapy to help individuals
Kelemer Brothers Helps Rockville Homeowners Save on Energy Bills with High-Efficiency Window Replacements
Kelemer Brothers Helps Rockville Homeowners Save on Energy Bills with High-Effic …
Kelemer Brothers helps Rockville homeowners reduce energy bills with high-efficiency window replacements, improving insulation and home comfort. Rockville, MD - Kelemer Brothers, a leading provider of window replacement services in Rockville, MD, is helping homeowners reduce their energy bills by offering high-efficiency Window replacement Rockville MD [https://www.kelemerbrothers.com/window-replacement-rockville-md/]. With the growing demand for energy-saving solutions, Kelemer Brothers is proud to provide cutting-edge window technology designed to enhance energy efficiency and comfort in

All 5 Releases


More Releases for TSV

TSV Electroplating Additive Market Size, Growth Opportunities and Forecast 2025- …
Los Angeles, United State: A newly published report titled "Global TSV Electroplating Additive Market Insights, Forecast to 2025-2031" by QY Research throws light on the industry dynamics and current and future trends that play a key role in determining the business expansion. The global TSV Electroplating Additive market was valued at US$ 224 million in 2024 and is anticipated to reach US$ 372 million by 2031, witnessing a CAGR of
Through Silicon Via (TSV) Technology Market 2022 | Detailed Report
The Through Silicon Via (TSV) Technology report compiles the market information depending upon market development and growth factors, optimizing the growth path. In addition, it highlights the strategies and market share of the leading vendors in the particular market. The report follows a robust research methodology model that helps to make informed decisions. It obtains both qualitative and quantitative market information supported by primary research. The Through Silicon Via (TSV) Technology
Through Silicon Via (TSV) Technology Market 2021 | Detailed Report
Global Through Silicon Via (TSV) Technology Market 2021-2027, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market. An exclusive data offered in this report is collected by research and industry experts team. Get Free Sample PDF (including full TOC,
3D TSV and 2.5D Market Size, Share, Development by 2024
Market Research Report Store offers a latest published report on 3D TSV and 2.5D Market Analysis and Forecast 2019-2025 delivering key insights and providing a competitive advantage to clients through a detailed report. The global 3D TSV and 2.5D market is valued at xx million USD in 2018 and is expected to reach xx million USD by the end of 2024, growing at a CAGR of xx% between 2019 and 2024. The
Global 3D TSV Market Share and Growth 2019 - QY Research
3D TSV is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter. The global 3D TSV market is valued at xx
3D TSV Packages Market Value Chain and Forecast 2016-2026
Currently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. 3D TSV is vertical electrical connection (via) passing completely through a silicon wafer or die. These short vertical interconnects are replacing the long interconnects of 2D packaging technologies including wire-bond and flip chips. Growing demand for high density and multifunctional microelectronics with improved performance, and the reduction of timing delays is