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Integrated Passive Devices Market to Reach USD 3.2 Billion by 2035, Growing at 7.0% CAGR - TMR Analysis
Integrated Passive Devices Market
Market Overview
The global Integrated Passive Devices market was valued at US$ 1.5 billion in 2024 and is projected to expand at a CAGR of 7.0% between 2025 and 2035, reaching US$ 3.2 billion by the end of the forecast period. IPDs which integrate passive components such as resistors, capacitors, and inductors onto a single substrate play a critical role in RF systems, power management, and signal conditioning for high-frequency, compact electronic circuits. Key end-use applications include consumer electronics, telecommunications, medical devices, and automotive systems.
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Market Drivers & Trends
Miniaturization and Performance in Consumer Electronics
Surging consumer demand for slimmer, lighter devices drives integration of passive elements directly onto chips.
System‐in‐Package (SiP) and 5G‐enabled products increasingly rely on IPDs to reduce board space, improve signal integrity, and enhance EMI shielding.
Power‐Efficient, High‐Density Solutions for Industrial & IoT Applications
Industrial automation and edge computing require devices that combine compact footprints with low power consumption.
With global semiconductor revenues at US$ 627.6 billion in 2024, advanced IPDs offer the right balance of density and efficiency to support billions of IoT endpoints.
Regulatory and Environmental Pressures
Stricter energy-saving norms compel manufacturers to adopt power-conserving components, further boosting IPD uptake in green electronics initiatives.
Latest Market Trends
Silicon Dominance in Substrates: Silicon IPDs captured 84.8% of market share in 2024, owing to their superior miniaturization potential and electrical performance-key for 5G, AI-powered sensors, and future automotive electronics.
3D IPD Technology Emergence: Manufacturers are exploring vertical integration of passive elements to further shrink device footprints and improve high-frequency response.
Hybrid Packaging Configurations: Flip-chip and wafer-level packaging are gaining traction for applications requiring both performance and cost-effectiveness.
Key Players:
Broadcom Inc.
CTS Corporation
Global Communication Semiconductors, LLC
Infineon Technologies AG
Johanson Technology, Inc.
MACOM
Murata Manufacturing Co., Ltd.
NXP Semiconductors
ON Semiconductor Corporation
Qurvo, Inc.
Skyworks Solutions, Inc.
STMicroelectronics N.V.
Taiwan Semiconductor Manufacturing Company Limited
TDK Corporation
Texas Instruments Incorporated
X-FAB Silicon Foundries SE
Among Others
Recent Developments
August 2024: Infineon introduced its CoolGaN Drive family, featuring integrated drivers within GaN switches for e-bikes, portable tools, and appliances, reducing size and cost while boosting efficiency.
September 2023: X-FAB Silicon Foundries SE expanded its RF IPD fabrication capabilities, enhancing its service offerings for wireless infrastructure components.
February 2023: STMicroelectronics rolled out a suite of nine RF IPDs that consolidate balun, filter, and matching networks on a single die, simplifying designs for 5G-enabled devices.
Market Opportunities
Automotive Electronics: IPDs are critical for advanced driver-assistance systems (ADAS), infotainment modules, vehicle-to-everything (V2X) connectivity, and battery management systems, where space and reliability are paramount.
Healthcare Wearables and Implantables: Demand for ultra‐compact, biocompatible passive components is rising as telemedicine and patient-monitoring devices proliferate.
Aerospace & Defense: Radar, satellite communications, and electronic warfare platforms require high-frequency IPDs with rigorous performance and environmental specifications.
Future Outlook
The IPD market is expected to witness sustained growth through 2035, driven by:
Continued 5G rollouts and the eventual transition to 6G networks.
Rapid proliferation of IoT devices forecast to exceed 29.4 billion connected units by 2030 spurring demand for cost-effective, space-saving components.
Advances in materials and fabrication, such as glass wafer and ceramic substrates, unlocking new performance thresholds for high-power and high-frequency use cases.
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Market Segmentation
By Passive Device: Baluns; Filters; Couplers; Diplexers & Triplexers; Resonators; Others (Power Splitters/Combiners, Attenuators)
By Substrate: Silicon; Glass Wafer; Ceramic; Others
By Technology: Thin-Film; Thick-Film; 3D IPD
By Packaging: Chip-Scale Package (CSP); Wafer-Level Package (WLP); SiP; Flip-Chip
By End-Use:
Consumer Electronics (Smartphones, Wearables, Tablets/Laptops, Smart TVs, Gaming Consoles)
Telecommunications (5G Infrastructure, Base Stations, Small Cells, Satellite, IoT Connectivity, Fiber Optic Networks)
Automotive (ADAS, Infotainment, BMS, V2X, Autonomous Driving, Telematics)
Healthcare (Wearable Health, Implantable Devices, Imaging, Monitoring, Diagnostics)
Aerospace & Defense (Radar, Satellite Comms, Military Radios, Avionics, EW, Space Exploration)
Industrial (Sensors, Automation, Motor Control, Surveillance)
Regional Insights
North America led with 27.8% market share in 2024, driven by its mature semiconductor fabrication ecosystem, robust 5G infrastructure development, and high R&D investment in defense and automotive electronics.
Asia-Pacific is projected to outpace all regions over the forecast period, underpinned by the world's largest consumer electronics manufacturing base in China, rapid 5G adoption in South Korea and Japan, and burgeoning semiconductor fabrication capacity in Taiwan and India.
Europe, Latin America, and Middle East & Africa are also investing in localized production and customization of IPDs to meet diverse industrial and telecom needs.
Why Buy This Report?
Authoritative Insight: Leverage in-depth qualitative and quantitative analysis, including market drivers, restraints, opportunities, and Porter's Five Forces assessment.
Actionable Intelligence: Identify key growth levers, emerging trends, and white-space opportunities for development of next-generation IPDs.
Comprehensive Coverage: Detailed segmentation analysis across device type, substrate, technology, packaging, end-use, and regional markets.
Competitive Benchmarking: Company profiles featuring strategic initiatives, financials, product portfolios, and recent developments of major industry players.
Customizable Format: Available in electronic PDF and accompanying Excel database for dynamic charting and scenario modelling.
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About Transparency Market Research
Transparency Market Research, a global market research company registered at Wilmington, Delaware, United States, provides custom research and consulting services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insights for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants use proprietary data sources and various tools & techniques to gather and analyses information.
Our data repository is continuously updated and revised by a team of research experts, so that it always reflects the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in developing distinctive data sets and research material for business reports.
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