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MEMS Packaging Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports
MEMS Packaging Market SizeThe global MEMS Packaging market is projected to grow from US$ 48080 million in 2024 to US$ 85640 million by 2030, at a Compound Annual Growth Rate (CAGR) of 10.1% during the forecast period.
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According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
By Type
• Inertial Sensors Packaging
• Optical Sensors Packaging
• Environmental Sensors Packaging
• Ultrasonic Sensors Packaging
By Application
• Automotive
• Mobile Phones
• Consumer Electronics
• Medical Systems
• Industrial
Key Companies:
ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., Texas Instruments Incorporated., Taiwan Semiconductor Manufacturing Company Limited, MEMSCAP, Orbotech Ltd., TDK Corporation
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