openPR Logo
Press release

Particle free Laser Trimming of Micro Mirror Devices

03-18-2008 04:24 PM CET | Industry, Real Estate & Construction

Press release from: 3D-Micromac AG

MEMS fabrication technologies cause tolerances in device dimensions and consequently on key parameters like the resonant frequency. In contrast to these manufacturing tolerances industrial applications require defined conditions.

Therefore 3D-Micromac AG has developed an industrial-applicable laser-trimming tool to overcome these tolerances. The processing of Silicon in particular Micro Mirror Devices (MMD) by ultra-short pulse is accom-panied by a very small heat affected zone and causes a minimum of stress into the material. The trimming of all MMDs on a wafer to a certain frequency value is performed by selective ablation of material. The reported technology promises an increasing yield and maximizes the efficiency in MEMS production because a post fabrication tuning of the resonant frequency by software is no longer necessary.

The main goal is to trim all mirror elements on a wafer. Additional trimming elements at frequency influencing mirror components enable a trimming of mirrors to a certain frequency value. The laser cutting of trimming elements at the torsion spring effects a frequency decrease because of lowering beam stiffness while the removal of mass trimming elements at the mirror plate increases frequency by mass reduction. The contami-nation with particles is reduced by processing in fine vacuum and bonding and reflecting areas of the MMD remain clean.

The new laser-tool, which has been developed in collaboration with the Center for Microtechnologies of Technical University of Chemnitz, enables the measurement and trimming of MMDs on a wafer and simpli-fies the industrial use.

Femtosecond laser sources suit the application as well as picosecond laser sources but a picosecond laser workstation is the first choice because of its higher repetition rate for the development of a suitable system for industrial use.

The laser trimming technique is not limited to Silicon Micro Mirror Devices. It also fits all kinds of sensors and actuators and suits a large variety of materials, for instance ceramics.

Frequency trimming of MEMS devices is a promising approach to overcome these manufacturing tolerances, to tune sensors and actuators for certain operating conditions and it promises an increasing yield in MEMS technology.

Further information and pictures:

3D-Micromac AG

Dipl.-Betriebswirt (BA) Mandy Möckel
Marketing/ Sales
Annaberger Str. 240
D-09125 Chemnitz

Phone: +49 (0)371 400 43-0
Fax: +49 (0)371 400 43-40

About 3D-Micromac AG

3D-Micromac AG, a leading supplier of customized laser micro machining systems, has gained an estab-lished position in the international market over the past several years.
As a developer and manufacturer of complex workstations, as a service provider for materials and surface machining or as a solution provider for the development of specific production processes - we are able to find the best solution for every customer’s task.

This release was published on openPR.

Permanent link to this press release:

Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.

You can edit or delete your press release Particle free Laser Trimming of Micro Mirror Devices here

News-ID: 39922 • Views: 1056

More Releases from 3D-Micromac AG

Increase in efficiency for thin-film solar modules: 3D-Micromac launches an inno …
Chemnitz, 03 June 2013. This June, 3D-Micromac from Chemnitz (Germany) will launch the first production equipment worldwide that can conduct the integrated series-connection of a thin-film solar module on one single platform and in one single production step. The new One-Stop-Patterning process (OSP) only structures the modules once all of the functional layers have been deposited on the substrate. This significantly simplifies the production process. In addition, the new
3D-Micromac receives „Green Photonics Award 2011“
SPIE honors research in the field of organic photovoltaics On January 26, 2011 3D-Micromac was honored with the “SPIE 2011 Green Photonics Award”. Tino Petsch, CEO of 3D-Micromac received the prize for the scientific publication “Laser processing of organic solar cells in a roll-to-roll manufacturing process” at the “Photonics West” in San Francisco. With this award, SPIE pays tribute to the outstanding research work of the company in the field of
ISL 2010 - International Symposium on Laser-Micromachining at 3D-Micromac taking …
Experts in the field of laser micromachining meet at ISL 2010 in Chemnitz, Germany for the third time Following the success of the ISL 2008 – 2nd International Symposium on Laser-Micromachining taken place in Chemnitz, Germany and ISL 2009 Asia held in HongKong, China, we are pleased to announce the ISL 2010 – 3rd International Symposium on Laser-Micromachining which will take place in Chemnitz, Germany on 27th – 28th October,
ISL 2008 - 2nd International Symposium on Laser-Micromachining at 3D-Micromac AG
Experts in the field of laser micromachining meet at ISL 2008 in Chemnitz, Germany at second time In the last years laser technologies not only confirmed their outstanding role for micro-machining but expanded it impressively. With enhancements in the areas of shorter pulses and shorter wavelengths there are growing possibilities to generate micro structures in all manufacturing sectors. Applications related to practice and latest trends will be presented by laser manufacturers and

All 12 Releases

More Releases for Micro

Digital Assurance Market Analysis 2018 And Global Top Vendors Profile Micro Focu …
The Global Digital Assurance Market accounted for USD 2.81 billion in 2017 and is projected to grow at a CAGR of 14.1% the forecast period of 2018 to 2025. The upcoming market report contains data for historic years 2016, the base year of calculation is 2017 and the forecast period is 2018 to 2025. Global Digital Assurance Market By Testing Mode (Manual testing and Test automation), By Testing Type (Application Programming Interface