Press release
Advanced Packaging Market Set to Reach USD 83.42 Bn by 2030
Advanced Packaging Market
The global advanced packaging market, valued at USD 38.93 billion in 2023, is projected to reach USD 83.42 billion by 2030, growing at a CAGR of 11.5% during the forecast period. This growth is driven by increasing demand for miniaturized devices, improved system performance, and the optimization of advanced packaging techniques.
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►Competitive Landscape and Regional Demand
Key players in the advanced packaging market include Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, ASE Technology Holding Co., Ltd., Amkor Technology, Inc., and Siliconware Precision Industries Co., Ltd. The Asia Pacific region holds the largest market share, accounting for over 65% in 2023, due to the presence of major semiconductor manufacturers and rapid industrialization.
► Regional Insights
♦ United States: Growth and Consolidation
In the United States, the advanced packaging sector is experiencing significant growth, fueled by increased investments and strategic partnerships. Applied Materials recently acquired a **9% stake in BE Semiconductor Industries (BESI), becoming its largest shareholder. This move underscores the strategic importance of advanced packaging technologies in the U.S. semiconductor industry.
♦ Asia Pacific: Opportunities and Trends
The Asia Pacific region continues to dominate the advanced packaging market, with countries like China, Taiwan, and South Korea leading in semiconductor manufacturing. TSMC announced a significant investment to build an advanced chip packaging plant in Taiwan, aiming to meet the booming global demand. Additionally, ASE Technology Holding Co., Ltd. projects its advanced packaging and testing revenue to more than double to $1.6 billion in 2025, up from $600 million in 2024.
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♦ Europe: Trends and Updation
European companies are actively engaging in strategic partnerships to enhance their positions in the advanced packaging market. BE Semiconductor Industries (BESI), a Dutch company specializing in advanced chip packaging tools, reported an 8.2% increase in first-quarter bookings to €131.9 million, reflecting heightened demand from Asian subcontractors for AI-related data center technologies.
♦ Middle East and Africa: Emerging Opportunities
While the Middle East and Africa currently hold a smaller share of the advanced packaging market, there is growing interest and investment in semiconductor technologies. Countries in these regions are exploring opportunities to establish semiconductor manufacturing facilities, aiming to diversify their economies and reduce reliance on traditional industries.
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► Market Segmentation: In-Depth Analysis:
♦ by Product Type
Active Packaging
Smart Packaging
Intelligent Packaging
Over the course of the projection period, the Flip Chip segment is expanding at the fastest rate. The advanced packaging market is expanding as a result of the growing use of small semiconductor components in high-performance industries including automotive and aerospace & defense. Many foundries and IDMs are adopting flip-chip advanced packaging because of its small footprint and high input/output density.
♦ by Packaging Type
3D Integrated Circuit
Fan Out Silicon in Package
Fan Out Wafer Lever Package
3D Wafer Level Package
Wafer Level Chip Scale Package
2.5D
Flip Chip
♦by Industrial Vertical
Consumer Electronics
IT & Telecommunication
Automotive & Transport
Healthcare
Aerospace & Defense
Others
In the industrial vertical, the consumer electronics segment is predicted to increase with the largest market share. Advanced packaging technologies are a result of the increasing demand for a variety of gadgets, such as tablets, smartphones, wearable technology, and other connected consumer electronics. System-In-Package (SIP) technology is also gaining traction since it makes it possible to include additional functions into compact form factors like wearable technology and medical implants.
For deeper market insights, peruse the summary of the research report:https://www.maximizemarketresearch.com/market-report/global-advanced-packaging-market/30807/
► Learn about the top players driving innovation in the Market :
1. ASE Group
2. Amkor Technology
3. Siliconware Precision Industries Co., Ltd. (SPIL)
4. STATS ChipPAC Pte. Ltd.
5. Jiangsu Changjiang Electronics Technology Co. Ltd.
6. SSS MicroTec AG.
7. International Business Machines Corporation (IBM)
8. Intel Corporation
9. Qualcomm Technologies, Inc.
10.Taiwan Semiconductor Manufacturing Company
11.Advanced Semiconductor Engineering Inc.
12.Chipbond Technology Corporation
13.Samsung Electronics Co. Ltd
14.Texas Instruments
15.Analog Devices
16.Microchip Technology
17.Renesas Electronics Corporation
18.TSMC
19.Deca Technologies
20.Sanmina Corporation
21.China Wafer Level CSP Co., Ltd.
22.ChipMOS Technologies, Inc.
23.FlipChip International LLC
24.HANA Micron Inc.
25.Jiangsu Changjiang Electronics Technology Co., Ltd
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► About Maximize Market Research:
Maximize Market Research is a multifaceted market research and consulting company with professionals from several industries. Some of the industries we cover include medical devices, pharmaceutical manufacturers, science and engineering, electronic components, industrial equipment, technology and communication, cars and automobiles, chemical products and substances, general merchandise, beverages, personal care, and automated systems. To mention a few, we provide market-verified industry estimations, technical trend analysis, crucial market research, strategic advice, competition analysis, production and demand analysis, and client impact studies.
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