Packaging Automation Market Future Business Opportunities 2024-2032 | ABB Ltd., BEUMER Group GmbH & Co.

Global Market Digits announces the release of the report "Global Packaging Automation Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2032". This report provides a detailed overview of the market scenario, including a thorough analysis of the market size, sales quantity, average price, revenue, gross margin and market share. The report provides an in-depth analysis of the competitive landscape, manufacturer's profiles, regional and national market dynamics, and the opportunities and challenge that the market may be exposed to in the near future. Global Packaging Automation Market research report is a comprehensive analysis of the current market trends, future prospects, and other pivotal factors that drive the market.

The Packaging Automation Market is Valued USD 70.407436 Billion in 2024 and projected to reach USD 141.0 billion by 2032, growing at a CAGR of 8.5% During the Forecast period of 2024-2032.

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Packaging Automation Market Growth Drivers

The development in discretionary income, which is resulting in an improvement in the level of life, has raised the demand for durable packaging solutions to assure the products' long-term durability throughout transit. Due to this feature, businesses in the e-commerce, logistics, food, and beverage, and healthcare industries are enticed to embrace cutting-edge packaging solutions in order to accelerate their manufacturing to a mass market. Due to the growing need for supply chain integration, several firms are also purchasing cutting-edge technology for the packaging of goods. These technologies improve the productivity of production line operations and assist businesses in reducing the workforce on production lines, saving both labor costs and production time.

Top companies covered in this report: ABB Ltd., BEUMER Group GmbH & Co., Rockwell Automation, Mitsubishi Electric Corp., Intel, Automated Packaging Systems, Linkx Packaging, Siemens AG, Swisslog Holding AG, SATO Holdings, Kollmorgen Corporation, Ranpak, Schneider Electric SE, Emerson Electric Co., Multivac Group, ULMA Packaging. and others.

Industry News:

May 2024: Intel, in collaboration with 14 Japanese companies, is spearheading the development of automation technology for 'backend' semiconductor processes, particularly in packaging. The collective goal is to achieve full automation by 2028. This strategic partnership aims to bolster manufacturing efficiency and plays a pivotal role in mitigating geopolitical risks within the semiconductor supply chain. Under the leadership of Kunimasa Suzuki, Managing Director of Intel Japan, the alliance is set to inject hundreds of billions of Japanese Yen into R&D, with a clear target of showcasing their technological advancements well before the 2028 deadline. Notable partners in this venture include Omron, Yamaha Motor, Resonac, and Shin-Etsu Polymer, a subsidiary of Shin-Etsu Chemical Industry.

Packaging Automation Market Segmentation:

By Offering
Solution
Services

By Function
Filling
Labelling
Case Packaging
Bagging
Palletizing
Capping
Wrapping
Other

By Automation Type
Robotic Pick & Place Automation
Secondary Packaging Automation
Tertiary & Palletizing Automation

By End-user
Healthcare & Pharmaceuticals
E-commerce & Logistics
Food & Beverage
Automotive
Chemical & Refinery
Aerospace & Defense
Other

Regional Analysis

North America (USA and Canada)
Europe (UK, Germany, France and rest of Europe)
Asia-Pacific (China, Japan, India, and Rest of Asia Pacific)
Latin America (Brazil, Mexico, and Rest of Latin America)
Middle East and Africa (GCC and Rest of the Middle East and Africa)

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Important Features of the reports:

- Detailed analysis of the Packaging Automation Market
- Fluctuating market dynamics of the industry
- Detailed market segmentation
- Historical, current and projected market size in terms of volume and value
- Recent industry trends and developments
- Competitive landscape of the Packaging Automation Market
- Strategies of key players and product offerings
- Potential and niche segments/regions exhibiting promising growth
- A neutral perspective towards Packaging Automation Market performance.

The report provides insights on the following pointers:

Market Penetration: Comprehensive information on the product portfolios of the top players in the Packaging Automation Market.

Product Development/Innovation: Detailed insights on upcoming technologies, R&D activities, and product launches in the market.

Competitive Assessment: In-depth assessment of the market strategies, and geographic and business segments of the leading players in the market.

Market Development: Comprehensive information about emerging markets. This report analyzes the market for various segments across geographies.

Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the Packaging Automation Market

How big will the market and growth rate be in 2032?

What are the key drivers for the global Packaging Automation Market?
What are the major market trends influencing the growth of the global Packaging Automation Market?
What are the challenges for market growth?
Who are the key vendors in the global Packaging Automation Market?
What market opportunities and threats are vendors facing in the global Packaging Automation Market?
What are the main findings of the five forces analysis of the global Packaging Automation Market?

Conclusion: At the end of the Packaging Automation Market report, all findings and estimates are presented. It also includes key drivers and opportunities and regional analysis. The Segmental analysis is also provided in terms of type and application.

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