Press release
Top Factor Driving Advanced Packaging Technologies Market Growth in 2025: Surging Consumer Electronics Demand Fuels Growth In The Advanced Packaging Market
Advanced Packaging Technologies
The advanced packaging market is expected to surge due to the ever-increasing demand for consumer electronics. These electronics include devices, gadgets or equipment intended for regular, non-commercial usage by consumers. The sophistication of these products is significantly determined by advanced packaging, thereby creating demand for it. For example, the Japan Electronics and Information Technology Industries Association reported in May 2023 that there were 771,457 units of electronic equipment produced in Japan. Furthermore, the production of consumer electronics increased to 32,099 units, showing a notable rise from 25,268 units in May 2022. As such, the escalating demand for consumer electronics is fuelling the expansion of the advanced packaging market.
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What growth opportunities are expected to drive the advanced packaging technologies market's CAGR through 2034?
The market size for advanced packaging technologies has experienced rapid expansion in the recent past. The market is projected to rise from $7.24 billion in 2024 to approximately $8.16 billion in 2025, recording a compound annual growth rate (CAGR) of 12.6%. This growth during the historical period is largely due to factors such as the expansion of consumer electronics, mobile computing, improved thermal management, automotive electronics, as well as environmental considerations.
Expectations are high for the advanced packaging technologies market to experience considerable growth in the upcoming years, with projections indicating a rise to $14.22 billion by 2029. This equates to a compound annual growth rate (CAGR) of 14.9%. This growth in the future could be a result of various factors including heterogeneous integration, quantum computing, flexible and stretchable electronics, strong supply chain resilience, and innovative smart manufacturing. Key trends predicted for this period involve advances in interconnect technologies, fan-out wafer-level packaging, system-in-package, thermal management solutions, and embedded packaging intended for IoT devices.
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What trends are poised to drive the future success of the advanced packaging technologies market?
Key players in the sector of advanced packaging technologies are actively pursuing the creation of technical solutions for advanced packaging as a means to strengthen their dominance in semiconductor solutions. Innovative techniques, materials, and machinery that boost packaging efficiency, shield the product, and augment functionality typically underpin these technological solutions for advanced packaging. They often include intelligent capabilities, automated features, or amplified sustainability. For example, in October of 2023, the Taiwan-based ASE Group from the Semiconductor Engineering field introduced the Integrated Design Ecosystem, which assists in augmenting silicon package design efficiencies and slashing cycle time in half. Through enhancing collaboration and optimisation in the design stage, this ecosystem enables faster revisions and superior performance in advanced packaging solutions. These advancements are in line with the escalating need for high-density packaging in fields such as Artificial Intelligence (AI), high-performance computing, and data centres.
Which growth-oriented segments of the advanced packaging technologies market are leading the industry's development?
The advanced packaging technologies market covered in this report is segmented -
1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Other Types
2) By Product: Active Packaging, Smart And Intelligent Packaging
3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Other End Use Industries
Subsegments:
1) By 3D Integrated Circuit: Through-Silicon Vias (TSVs), Monolithic 3D ICs
2) By 2D Integrated Circuit: Flat Packaging, Chip-on-Board (CoB)
3) By 2.5D Integrated Circuit: Interposer-Based Packaging, Silicon Bridge Technologies
4) By Other Types: Fan-Out Wafer Level Packaging (FOWLP), System-in-Package (SiP), Multi-Chip Modules (MCM)
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What regions are leading the charge in the advanced packaging technologies market?
Asia-Pacific was the largest region in global advanced packaging technologies market in 2024. The regions covered in the advanced packaging technologies market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
What companies are at the forefront of innovation in the advanced packaging technologies market?
Major companies operating in the advanced packaging technologies market include Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SÜSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems
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What Is Covered In The Advanced Packaging Technologies Global Market Report?
• Market Size Forecast: Examine the advanced packaging technologies market size across key regions, countries, product categories, and applications.
• Segmentation Insights: Identify and classify subsegments within the advanced packaging technologies market for a structured understanding.
• Key Players Overview: Analyze major players in the advanced packaging technologies market, including their market value, share, and competitive positioning.
• Growth Trends Exploration: Assess individual growth patterns and future opportunities in the advanced packaging technologies market.
• Segment Contributions: Evaluate how different segments drive overall growth in the advanced packaging technologies market.
• Growth Factors: Highlight key drivers and opportunities influencing the expansion of the advanced packaging technologies market.
• Industry Challenges: Identify potential risks and obstacles affecting the advanced packaging technologies market.
• Competitive Landscape: Review strategic developments in the advanced packaging technologies market, including expansions, agreements, and new product launches.
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