Press release
The Impact Of Surging IoT Demand On Molded Interconnect Devices Market Driver: Leading Transformation in the Molded Interconnect Device (MID) Market in 2025
Molded Interconnect Device (MID) Market Size
The surge in the use of IoT devices is projected to fuel the expansion of the molded interconnect devices market. IoT devices represent a vast number of physical items networked to the internet, which collect and share data with other devices and systems online. The burgeoning need for the Internet of Things (IoT), quantum computing, and 5G, together with an escalating demand for greater computational speed, low-energy gadgets, and smart chipsets within the hyper-connected world, dramatically influences semiconductor & electronics industry dynamics. A report from Techjury, published in August 2022 and drawing from IoT Analytics, highlighted that sectors with highest active corporate IoT initiatives were Smart City (23%), Connected Industry (17%) and Connected Building (12%). Moreover, 97% of companies found it difficult to derive value from IoT-related data. Hence, the rising need for IoT devices will stimulate the market for molded interconnect devices.
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What is the projected compound annual growth rate (CAGR) of the molded interconnect device (mid) market from 2025 to 2034, and what factors influence it?
In recent times, the molded interconnect device (MID) market has experienced substantial growth. The market value is projected to climb from $1.75 billion in 2024 to $2.03 billion in 2025, indicating a compound annual growth rate (CAGR) of 16.4%. The historical development of this market has been shaped by factors such as the trend towards miniaturization, advances in consumer electronics, the evolution of automotive electronics, breakthroughs in medical devices, and the shift towards intelligent manufacturing.
In the coming years, the market size of Molded Interconnect Device (MID) is anticipated to experience swift expansion. It's projected to reach a value of $3.7 billion in 2029, with a compound annual growth rate (CAGR) of 16.2%. This predicted growth during the forecast period can be linked to the continued transformation of consumer electronics, augmentation in medical device integration, expansion of automotive electronics, swift prototyping and advancements in manufacturing. Predominant trends during this period encompass compliance with regulations and quality standards, customization paired with design adaptability, advancements in quick prototyping and manufacturing technologies, improvements in sustainability and materials, and the influence of Industry 4.0 and intelligent manufacturing.
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How are the latest trends influencing the growth of the molded interconnect device (mid) market?
The primary trend gaining traction in the molded interconnect device market is technological advancement. Companies engaged in molded connection devices are focused on developing revolutionary technology solutions adaptable to other elements, leading to the growth of technologies such as laser plastic welding. For example, SABIC, a Saudi Arabia-based chemical firm specializing in the manufacture of chemicals, plastics, agri-nutrients, and metals, introduced the LNP THERMOCOMP OFC08V compound in April 2022. This compound provides a high-performance solution for 5G base station dipole antennas and various electrical and electronic applications. The product is a glass fiber-reinforced material made from polyphenylene sulfide (PPS) resin, created to facilitate cost-effective and lightweight all-plastic antenna designs. Its performance is superior in laser direct structuring (LDS) plating and provides excellent adhesion between layers, efficient warpage management, as well as reliable dielectric and radio frequency (RF) elements.
What are the major segments of the molded interconnect device (mid) market and their role in driving growth?
The molded interconnect device (MID) market covered in this report is segmented -
1) By Product: Antenna And Connectivity Modules, Connectors And Switches, Sensors, Lighting
2) By Process: Laser Direct Structuring (LDS), Two-Shot Molding, Other Processes
3) By Application: Automotive, Consumer Products, Healthcare, Industrial, Military And Aerospace, Telecommunication And Computing
Subsegments:
1) By Antenna And Connectivity Modules: Integrated Antennas, RF Modules
2) By Connectors And Switches: Electrical Connectors, Mechanical Switches
3) By Sensors: Temperature Sensors, Pressure Sensors, Proximity Sensors
4) By Lighting: LED Lighting Modules, Decorative Lighting Solutions
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Which regions are key players in the growth of the molded interconnect device (mid) market?
Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Who are the key firms paving the way for growth in the molded interconnect device (mid) market?
Major companies operating in the molded interconnect device (MID) market are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG
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What Is Covered In The Molded Interconnect Device (MID) Global Market Report?
• Market Size Forecast: Examine the molded interconnect device (mid) market size across key regions, countries, product categories, and applications.
• Segmentation Insights: Identify and classify subsegments within the molded interconnect device (mid) market for a structured understanding.
• Key Players Overview: Analyze major players in the molded interconnect device (mid) market, including their market value, share, and competitive positioning.
• Growth Trends Exploration: Assess individual growth patterns and future opportunities in the molded interconnect device (mid) market.
• Segment Contributions: Evaluate how different segments drive overall growth in the molded interconnect device (mid) market.
• Growth Factors: Highlight key drivers and opportunities influencing the expansion of the molded interconnect device (mid) market.
• Industry Challenges: Identify potential risks and obstacles affecting the molded interconnect device (mid) market.
• Competitive Landscape: Review strategic developments in the molded interconnect device (mid) market, including expansions, agreements, and new product launches.
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