Ball Grid Array Packaging Market is Expected to Progress at a CAGR of 3.2% by 2034 | FMI

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 billion in 2024. According to industry forecasts, the market is expected to expand at a CAGR of 3.2% over the next decade, reaching a valuation of USD 1.76 billion by 2034.

Ball grid array (BGA) packaging continues to play a crucial role in the semiconductor industry, providing enhanced electrical and thermal performance for integrated circuits. The increasing demand for high-performance computing, miniaturized electronic devices, and advancements in semiconductor technology are key factors driving market growth.

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The ball grid array (BGA) packaging industry is witnessing significant expansion, fueled by the increasing demand for high-performance, denser compact packaging solutions. As consumer electronics such as smartwatches, smartphones, and televisions continue to proliferate, they are emerging as the primary catalysts for growth in the BGA packaging market.

The BGA packaging market is rapidly gaining momentum due to its cost-effectiveness, compact design, and superior performance capabilities. The increasing demand for diverse, smaller-sized packaging solutions from electronic original equipment manufacturers (OEMs) is propelling further growth. Additionally, the burgeoning semiconductor and integrated circuit (IC) chip industry is another key factor strengthening the BGA market outlook for the forecast period.

Key Ball Grid Array (BGA) Packaging Market Takeaways and Projections

• The global ball grid array (BGA) packaging market was valued at USD 1.13 billion in 2019 and grew at a CAGR of 2.3%, reaching USD 1.23 billion in 2023.
• India is expected to lead the BGA packaging market over the next decade with a CAGR of 4.9%.
• China is also set for significant growth in the BGA packaging market, with a projected CAGR of 4.4% over the next decade.
• South Korea is anticipated to see strong growth in its BGA packaging market, with a forecasted CAGR of 3.7%.
• The Plastic Ball Grid Array (PBGA) segment is expected to dominate the market, capturing a 73.6% value share in 2024.
• Die-down cross-section is projected to be the leading die type in the BGA packaging market, holding a 52.1% value share in 2024.

Prominent Drivers of the Ball Grid Array (BGA) Packaging Market

• Rising Demand for Miniaturized Electronic Devices: The increasing adoption of compact and lightweight consumer electronics, such as smartphones, tablets, and wearables, is driving the need for BGA packaging, which enables higher component density and improved performance.
• Growing Adoption of IoT and AI-Driven Devices: The expansion of the Internet of Things (IoT) and artificial intelligence (AI) applications is fueling the demand for advanced semiconductor packaging solutions like BGA, which offer enhanced thermal management and electrical performance.
• Expansion of the Automotive Electronics Sector: The increasing integration of advanced driver-assistance systems (ADAS), infotainment systems, and electric vehicle (EV) components is boosting the demand for reliable and durable BGA packaging solutions in the automotive industry.

Competitive Landscape Analysis

Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co., STATS ChipPAC Ltd., and ASE Group are among the industry's leading players. Companies are investing in R&D to create smaller, higher-density packaging options.

Material and manufacturing technology advancements are crucial. Manufacturers are working to develop new materials that can endure higher temperatures and provide improved electrical performance.

With rising environmental concerns, businesses are implementing eco-friendly packaging options. This involves using recyclable materials and producing less trash during the manufacturing process. There is a growing demand for customized packaging solutions adapted to specific uses. Businesses are improving their design capabilities in order to provide tailored solutions that match the needs of each individual client.

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Industry Updates

• In May 2024, Petteri Aimonen turned razor blade plastic in a smart periscope for easy BGA inspection.
• In March 2024, Micron Technology is establishing an Assembly and Test Facility in Gujrat, India, which will be focusing on forming wafers in ball grid array (BGA) integrated circuit packages, memory modules, and solid-state drives.

Key Segments of Market Report

By Material:

Material is segmented into Ceramic (CBGA) and Plastic (PBGA).

By Die Type:

Die up cross-section, die down cross-section, and stacked are the die types.

By Application:

Wafer scale packaging, optoelectronic, laser diode packaging, rf device packaging, power amplifier packaging, and power transistor packaging are the applications.

By Region:

The industry is spread across North America, Latin America, Europe, East Asia, South Asia, Oceania, and the Middle East and Africa.

Have a Look at Related Research Reports on the Packaging Domain:

Food Packaging Market - https://www.futuremarketinsights.com/reports/food-packaging-market

Biodegradable Films Market - https://www.futuremarketinsights.com/reports/biodegradable-films-market

Packing Paper Market - https://www.futuremarketinsights.com/reports/packing-paper-market

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