Press release
Global Through-Hole Passive Components Market 2025: Strong Growth, Key Trends, and Leading Players
Through-Hole Passive Components Market Share 2025
What Is The Projected Market Size Of The Global Through-Hole Passive Components Market And Its Growth Rate?
The through-hole passive components market is showing promising prospects with:
•A growth from $38.18 billion in 2024 to $40.58 billion in 2025 at a CAGR of 6.3%
•Expansion to $53.16 billion in 2029 at a CAGR of 7.0%
Future growth can be attributed to burgeoning sectors like renewable energy systems, smart grid technologies, IoT expansion, electric vehicles' market growth, and 5G network deployment.
What Is Driving The Growth In The Through-Hole Passive Components Market?
The rising demand for consumer electronic devices is significantly fuelling the growth of the through-hole passive component market. In 2023, the monthly retail sales of electronics and appliances in the U.S. touched $7.59 billion, indicating an impressive rise over a two-year period. This surge in demand for electrical components, including smart home gadgets, wearables, and other connected devices, is stimulating the popularity and market growth of through-hole passive components.
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Who Are the Key Players Driving Through-Hole Passive Components Market Growth?
Leading players in the market include:
•Panasonic Holdings Corporation
•TE Connectivity Ltd.
•TDK Corporation
•Murata Manufacturing Co Ltd.
•Rohm Co Ltd.
•YAGEO Corp
•Vishay Intertechnology Inc.
•Bourns Inc.
•Taiyo Yuden Co Ltd.
•Würth Elektronik Group
•AVX Corporation
•Nichicon Corporation
•KEMET Corporation
•Nippon Chemi-Con Corporation
•KYOCERA AVX Components Corporation
•Rubycon Corporation
•Holy Stone Enterprise Co Ltd.
•Lelon Electronics Corp
•Elna Co Ltd.
•Sagami Elec Co Ltd.
•Cornell Dubilier Electronics Inc.
•KOA Speer Electronics Inc.
•NIC Components Corporation
•WIMA GmbH & Co KG
What Are The Key Trends In The Through-Hole Passive Components Market?
Key trends shaping the herizon include:
•Expansion of application areas in automotive electronics
•Integration of through-hole components in IoT devices
•Emphasis on high-temperature and harsh environment components
•Introduction of low-profile through-hole inductors
•Increased automation in through-hole component manufacturing
What Are The Segments Of The Global Through-Hole Passive Components Market?
The market is segmented by:
1) Component: Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, Other Components
2) Leads Model: Axial, Radial
3) Application: Consumer Electronics, Automotive, Industrial, IT And Telecom, Aerospace And Defense, Healthcare And Life Sciences, Other Applications
Which Region Leads The Through-Hole Passive Components Market?
Asia-Pacific region emerged as the largest market for through-hole passive components in 2024 and is expected to sustain this lead with the fastest growth rate during the forecast period. Other regions analyzed in the report include Western Europe, Eastern Europe, North America, South America, Middle East, and Africa.
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What Is Covered In The Through-Hole Passive Components Global Market Report?
- Market Size Analysis: Analyze the Through-Hole Passive Components Market size by key regions, countries, product types, and applications.
- Market Segmentation Analysis: Identify various subsegments within the Through-Hole Passive Components Market for effective categorization.
- Key Player Focus: Focus on key players to define their market value, share, and competitive landscape.
- Growth Trends Analysis: Examine individual growth trends and prospects in the Market.
- Market Contribution: Evaluate contributions of different segments to the overall Through-Hole Passive Components Market growth.
- Growth Drivers: Detail key factors influencing market growth, including opportunities and drivers.
- Industry Challenges: Analyze challenges and risks affecting the Through-Hole Passive Components Market.
- Competitive Developments: Analyze competitive developments, such as expansions, agreements, and new product launches in the market.
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