Press release
Wafer Bonding Equipment Market Size, Share, Trends, Market Growth and Business Strategies 2025-2032
Wafer bonding equipment plays a critical role in the semiconductor industry, enabling the creation of advanced semiconductor devices by bonding two or more wafers together. As the wafer bonding equipment market continues to expand, driven by growing demand for high-performance chips, the wafer bonding equipment market size is projected to increase significantly. With key players capturing substantial portions of the market, the wafer bonding equipment market share is becoming more concentrated, while the wafer bonding equipment market growth remains strong due to innovations and technological advancements.
➣ Market Growth
The Global Wafer Bonding Equipment Market was valued at US$ 316.7 million in 2022 and is projected to reach US$ 461 million by 2029, at a CAGR of 5.5% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
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https://semiconductorinsight.com/report/wafer-bonding-equipment-market/
➣ Total Market by Segment:
Global Wafer Bonding Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units) Global Wafer Bonding Equipment Market Segment Percentages, by Type, 2022 (%)
Fully Automatic
Semi Automatic
Global Wafer Bonding Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, by Application, 2022 (%)
MEMS
Advanced Packaging
CIS
Others
Global Wafer-Bonding Equipment Market, by Wafer Size, 2018-2023, 2024-2029 ($ Millions) & (Units) Global Wafer-Bonding Equipment Market Segment Percentages, by Wafer Size, 2022 (%)
4 Inch
6 Inch
8 Inch
12 Inch
Others
Global Wafer-Bonding Equipment Market, by End-User, 2018-2023, 2024-2029 ($ Millions) & (Units) Global Wafer-Bonding Equipment Market Segment Percentages, by End-User, 2022 (%)
Integrated Device Manufacturers (IDMs)
Foundries
Global Wafer-Bonding Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer-Bonding Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America (United States, Canada, Mexico)
Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
The Middle East and Africa (Middle East, Africa)
South and Central America (Brazil, Argentina, Rest of SCA)
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Further, the report presents profiles of competitors in the market, key players include:
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machinetool
Ayumi Industry
Shanghai Micro Electronics
U-Precision Tech
Hutem
Canon
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FAQs -
Q. What is the size of the semiconductor bonding equipment market?
The global wafer bonding equipment market was valued at USD 316.7 million in 2022 and is projected to reach USD 461 million by 2029, growing at a CAGR of 5.5% during the forecast period.
Q. Who are the major semiconductor bonding equipment industry participants?
A. Major participants in the wafer bonding equipment industry include EV Group, SUSS MicroTec, Tokyo Electron, and Kulicke & Soffa, among others. These companies are key players in the market, offering a variety of bonding technologies used in semiconductor manufacturing.
Q. Which regions dominate the wafer bonding equipment market?
A. The Asia-Pacific region holds the largest share of the market, followed by Europe and North America.
Q. What are the main applications of wafer bonding equipment?
A. The key applications include MEMS, advanced packaging, and CMOS image sensors (CIS).
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About Semiconductor Insight:
Established in 2016, Semiconductor Insight specializes in providing comprehensive semiconductor industry research and analysis to support businesses in making well-informed decisions within this dynamic and fast-paced sector. From the beginning, we have been committed to delivering in-depth semiconductor market research, identifying key trends, opportunities, and challenges shaping the global semiconductor industry.
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