Wafer Bond Alignment System Market Size, Trends, Growth Analysis, and Forecast | Valuates Reports

Wafer Bond Alignment System Market Size

The global market for Wafer Bond Alignment System was valued at US$ 249 million in the year 2023 and is projected to reach a revised size of US$ 423 million by 2030, growing at a CAGR of 7.9% during the forecast period.

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North American market for Wafer Bond Alignment System is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

Asia-Pacific market for Wafer Bond Alignment System is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

The major global manufacturers of Wafer Bond Alignment System include Mycronic, ASMPT, BESI, EV Group, Advanced Spectral Technology, Applied Microengineering Ltd, Marubeni Information System, Ayumi Industry, SUSS MicroTec, FINETECH, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

By Type
• Manual
• Semi Automatic
• Fully Automatic

By Application
• 4-inch Wafer
• 6-inch Wafer
• 8-inch Wafer
• 12-inch Wafer

Key Companies
Mycronic, ASMPT, BESI, EV Group, Advanced Spectral Technology, Applied Microengineering Ltd, Marubeni Information System, Ayumi Industry, SUSS MicroTec, FINETECH, KLA, FIBERPRO, Guangdong Istar Technology Equipment, Jiangsu Yonghuai Technology, Shenzhen Vector Science, Shanghai P&B Technology

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This release was published on openPR.