Semiconductor Rubber Socket Market Size, Trends, Growth Analysis, and Forecast | Valuates Reports

Semiconductor Rubber Socket Market Size

The global Semiconductor Rubber Socket market was valued at US$ 163 million in 2023 and is anticipated to reach US$ 447 million by 2030, witnessing a CAGR of 13.8% during the forecast period 2024-2030.

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North American market for Semiconductor Rubber Socket is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

Asia-Pacific market for Semiconductor Rubber Socket is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

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The major global manufacturers of Semiconductor Rubber Socket include ISC, TSE Co., Ltd., JMT (TFE), SNOW Co., Ltd., SRC Inc., Smiths Interconnect, WinWay Technology, Ironwood Electronics, LEENO, TwinSolution Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

Major Trends in the Semiconductor Rubber Socket Market

1. Growing Demand from Advanced Semiconductor Applications With the increasing adoption of advanced semiconductors in AI, IoT, and 5G technologies, the demand for durable and efficient rubber sockets for testing and interfacing has surged. These sockets play a critical role in ensuring seamless connections during high-performance operations.

2. Miniaturization of Semiconductor Components
As semiconductor devices become smaller and more compact, rubber sockets are evolving to support microchip designs. Manufacturers are focusing on creating sockets with higher precision and the ability to handle ultra-small form factors.

3. Adoption of High-Temperature-Resistant Materials
The need for semiconductor devices to operate under extreme conditions is driving the development of rubber sockets made from materials with superior heat resistance. This trend is particularly prominent in industries such as automotive and aerospace.

By Type
• Pitch:≤0.3P
• Pitch:0.3-0.8P
• Pitch: ≥0.8P

By Application
• Mobile AP/CPU/GPU
• LSI (CSI, PMIC,RF)
• NAND Flash
• DRAM

Key Companies
ISC, TSE Co., Ltd., JMT (TFE), SNOW Co., Ltd., SRC Inc., Smiths Interconnect, WinWay Technology, Ironwood Electronics, LEENO, TwinSolution Technology, Shenzhen Jixiangniao Technology, TESPRO Co.,Ltd., SUNGSIM Semiconductor, Micronics Japan Co., Ltd., Suntest Korea, Micro Sensing Lab, United Precision Technologies, Wuxi Bishiden Technology

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Valuates offers an extensive collection of market research reports that helps companies to take intelligent strategical decisions based on current and forecasted Market trends.

Valuates offers an extensive collection of market research reports that helps companies to take intelligent strategical decisions based on current and forecasted Market trends.

This release was published on openPR.