Introducing IMMC-1: KoolMicro's Revolutionary Cooling Technology at CES 2025

Innovative cooling tech promises better data center efficiency and opens doors for future advances. Dongtan, December 31, 2024 - KoolMicro is excited to exhibit at CES 2025's Eureka Park to showcase our latest innovation, the IMMC-1 (Integrated Manifold MicroChannel -1). "Our selection for Eureka Park at CES 2025 reflects our commitment to advancing cooling technology in a competitive landscape," stated Wonyoung Maeng, CSO. "This year's crowded field shows our commitment to innovation. The IMMC-1 stands out, building on our recent breakthroughs that set new standards for cooling performance."

Feature 1: Smart Engineering The IMMC-1 utilizes advanced microchannel technology, achieving an impressive cooling capacity of 1,000 W/cm² (=4,000 W/4cm²). This clever design cuts thermal resistance by 20% and boosts computing speed by 12%, handling heat well in high-power uses.

Feature 2: Smart Design With a closed-loop liquid cooling system made of high thermal conductive materials, the IMMC-1 not only optimizes cooling efficiency but also minimizes environmental impact, cutting energy use and CO₂ emissions by 50%. Its compact design enhances space utilization in data centers.

Feature 3: One-of-a-Kind and Real As a part of KoolMicro's roadmap, the IMMC-1 is a step towards future tech, including our goal of 2,000 W/cm² cooling. This vision positions KoolMicro as a leader in thermal management, ready to adapt to market demands and advance semiconductor cooling technologies.

Come see us at CES 2025 for a live demo of the IMMC-1, where our engineers will explain this groundbreaking tech and how it can be used.

KoolMicro keeps working on new ideas to make things better for users and help create a sustainable future. If you want to invest or learn more about our products, please reach out. Visit our website at http://www.koolmicro.com "New ideas for a greener tomorrow."

Media Contact: Wonyoung Maeng, CSO [Email: info@koolmicro.com]

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KoolMicro
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KoolMicro represents kingly cooling solutions for microelectronics. As pioneers in the development of advanced, heterogeneous cooling technologies integrated with next-generation AI packaging, we bring over 25 years of expertise in semiconductor chip architecture and packaging. This extensive experience allows us to deeply understand the challenges faced by our customers. Our patented Integrated Manifold MicroChannel (IMMC) technology is the pinnacle of innovation, addressing thermal and mechanical bottlenecks in next-generation semiconductor devices. KoolMicro is prepared to deliver tailored cooling solutions for data centers, automotive applications, semiconductors, and high-performance computing, including AI-driven tasks.

This release was published on openPR.