Press release
Semiconductor Advanced Packaging Market Forecasted to Hit US$ 26.27 Billion by 2030, Fuelled by Telecom, Automotive, and Consumer Electronics Sectors | Valuates Reports
Semiconductor Advanced Packaging - Market SizeThe global market for Semiconductor Advanced Packaging was estimated to be worth US$ 15670 million in 2023 and is forecast to a readjusted size of US$ 26270 million by 2030 with a CAGR of 7.5% during the forecast period 2024-2030.
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Major Trends in the Semiconductor Advanced Packaging Market:
1. Miniaturization and Increased Performance: The push for smaller, more efficient electronic devices is driving the need for advanced packaging solutions. Packaging technologies like 2.5D/3D packaging enable higher performance while reducing the physical footprint of components.
2. Growth in Consumer Electronics and Automotive: The demand for advanced packaging is particularly high in consumer electronics, where devices are becoming more powerful and compact. Similarly, the automotive industry's increasing adoption of semiconductor-based systems, such as those in electric vehicles and autonomous driving technologies, is boosting market growth.
3. Integration of 5G and Telecom Applications: The rollout of 5G networks is generating demand for advanced semiconductor packaging solutions to support high-frequency applications in telecommunications equipment.
4. Focus on Sustainability: Companies are moving toward more sustainable packaging materials and methods to reduce waste and energy consumption, aligning with the growing trend toward eco-friendly practices in manufacturing.
Challenges in the Semiconductor Advanced Packaging Market:
1. Complexity and Cost: Advanced packaging technologies, particularly 3D packaging, involve complex design and manufacturing processes, leading to higher production costs.
2. Supply Chain Issues: The global semiconductor supply chain is still recovering from disruptions, making it difficult to meet growing demand for packaging solutions.
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By Type
• Fan-Out Wafer-Level Packaging (FO WLP)
• Fan-In Wafer-Level Packaging (FI WLP)
• Flip Chip (FC)
• 2.5D/3D
By Application
• Telecommunications
• Automotive
• Aerospace and Defense
• Medical Devices
• Consumer Electronics
Key Companies
Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung, TSMC (Taiwan Semiconductor Manufacturing Company), China Wafer Level CSP, ChipMOS Technologies, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), Signetics, Tianshui Huatian, Veeco/CNT, UTAC Group
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