Press release
Unlocking the Future of Advanced Packaging: Trends Shaping 3D IC and 2.5D IC Innovation
Ready to Dive into Something Exciting? Get Your Free Exclusive Sample of Our Research Report @
https://www.thebusinessresearchcompany.com/sample.aspx?id=12128&type=smp
According to The Business Research Company's, The 3d ic and 2.5d ic packaging market size has grown rapidly in recent years. It will grow from $48.6 billion in 2023 to $54.39 billion in 2024 at a compound annual growth rate (CAGR) of 11.9%. The growth in the historic period can be attributed to miniaturization of electronic devices, demand for improved power efficiency, demand for improved signal integrity, demand for consumer electronics and gaming devices, performance enhancement.
The 3d ic and 2.5d ic packaging market size is expected to see rapid growth in the next few years. It will grow to $81.67 billion in 2028 at a compound annual growth rate (CAGR) of 10.7%. The growth in the forecast period can be attributed to emergence of wearable and portable devices, growing need for energy efficiency, rising demand for high-performance computing (hpc), shift toward system-on-chip (soc) designs, increasing complexity of semiconductor devices, iot proliferation. Major trends in the forecast period include 5g technology advacements , advanced interconnect technologies, industry collaboration and standards, technological advancements in semiconductor technology, innovation in packaging materials.
Get The Complete Scope Of The Report @
https://www.thebusinessresearchcompany.com/report/3d-ic-and-2-5d-ic-packaging-global-market-report
Market Drivers and Trends:
The growing demand for consumer electronics is expected to propel the growth of the 3D IC and 2.5D IC packaging market going forward. Consumer electronics refers to any electronic equipment created to be bought and utilized by consumers or end users for personal, daily, and non-commercial uses. 3D IC (Integrated Circuit) and 2.5D IC packaging are advanced packaging technologies that offer enhanced performance, increased functionality, and the miniaturization of electronic devices. The growing demand for consumer electronics and gaming devices is driven by technological advancements, increasing disposable income, gaming industry expansion, digital transformation, remote work, and entertainment trends, changing lifestyles and preferences, and the influence of social media and content consumption. For instance, in January 2023, according to the annual financial report 2022 published by LG, a South Korea-based consumer electronics company, the sales for 2022 witnessed a growth of 12.9% compared to the previous year, when sales surpassed approximately $52.70 billion. Further, the LG Home Appliance & Air Solution Company also recorded another record-breaking year with a revenue of $22.5 billion in 2022, marking a 10.3% increase from the previous year. Therefore, the growing demand for consumer electronics is driving the growth of the 3D IC and 2.5D IC packaging market.
Technological advancements are a key trend gaining popularity in the 3D IC and 2.5D IC packaging market. Major companies operating in the 3D IC and 2.5D IC packaging market are adopting new technologies to sustain their position in the market. For instance, in June 2022, ASE Technology Holding Co. Ltd., a Taiwan-based provider of semiconductor manufacturing services, launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. It is the next generation of 3D heterogeneous integration architecture from ASE that expands design guidelines and delivers exceptionally high performance and density. The platform enables companies to achieve unparalleled creativity when integrating several chips into a single package. It utilizes advanced redistribution layer (RDL) technologies, embedded integration, and 2.5D and 3D technologies. Six fundamental packaging technology pillars comprise ASE's VIPack, complemented by a wide-ranging co-design ecosystem. These include ASE's high-density through Silicon Via (TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities, as well as Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP)-based technologies.
Key Benefits for Stakeholders:
• Comprehensive Market Insights: Stakeholders gain access to detailed market statistics, trends, and analyses that help them understand the current and future landscape of their industry.
• Informed Decision-Making: The reports provide crucial data that support strategic decisions, reducing risks and enhancing business planning.
• Competitive Advantage: With in-depth competitor analysis and market share information, stakeholders can identify opportunities to outperform their competition.
• Tailored Solutions: The Business Research Company offers customized reports that address specific needs, ensuring stakeholders receive relevant and actionable insights.
• Global Perspective: The reports cover various regions and markets, providing a broad view that helps stakeholders expand and operate successfully on a global scale.
Major Key Players of the Market:
Samsung Electronics Co. Ltd., Siemens AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Limited, SK Hynix Inc., Broadcom Inc., Fujitsu Limited, Toshiba Corporation, ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, STMicroelectronics NV, Infineon Technologies AG, Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Unimicron Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Cadence Design Systems Inc., Siliconware Precision Industries Co. Ltd., Powertech Technology Inc., Ansys Inc., STATS ChipPAC Pte. Ltd., Synopsys Inc, UTAC Holdings Ltd., Tessolve Semiconductor Private Limited, Invensas Corporation, National Center for Advanced Packaging Co. Ltd., Tohoku-MicroTec Co. Ltd, TechSearch International Inc.
3D IC And 2.5D IC Packaging Market 2024 Key Insights:
• The 3d ic and 2.5d ic packaging market size is expected to see rapid growth in the next few years. It will grow to $81.67 billion in 2028 at a compound annual growth rate (CAGR) of 10.7%.
• Surging Demand For Consumer Electronics To Drive Market Growth
• Technological Advancements In 3D Ic And 2.5D Ic Packaging Market
• Asia-Pacific was the largest region in the 3D IC and 2
We Offer Customized Report, Click @
https://www.thebusinessresearchcompany.com/Customise?id=12128&type=smp
Contact Us:
The Business Research Company
Europe: +44 207 1930 708
Asia: +91 88972 63534
Americas: +1 315 623 0293
Email: info@tbrc.info
Follow Us On:
LinkedIn: https://in.linkedin.com/company/the-business-research-company
Twitter: https://twitter.com/tbrc_info
YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ
Learn More About The Business Research Company
The Business Research Company (www.thebusinessresearchcompany.com) is a leading market intelligence firm renowned for its expertise in company, market, and consumer research. With a global presence, TBRC's consultants specialize in diverse industries such as manufacturing, healthcare, financial services, chemicals, and technology, providing unparalleled insights and strategic guidance to clients worldwide.
This release was published on openPR.
Permanent link to this press release:
Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release Unlocking the Future of Advanced Packaging: Trends Shaping 3D IC and 2.5D IC Innovation here
News-ID: 3762398 • Views: …
More Releases from The Business Research Company
Global High-Resolution Anoscopy Market Outlook 2025-2034: Trends, Innovations, A …
The High-Resolution Anoscopy Market Report by The Business Research Company delivers a detailed market assessment, covering size projections from 2025 to 2034. This report explores crucial market trends, major drivers and market segmentation by [key segment categories].
What Is the High-Resolution Anoscopy Market Size and Projected Growth Rate?
The market size for high-resolution anoscopy has experienced significant growth over the past few years. The market is predicted to increase from $15.03 billion…
Condyloma Acuminata Treatment Market Size Projected To Reach $2.2 Billion By 203 …
"The Condyloma Acuminata Treatment Market Report by The Business Research Company delivers a detailed market assessment, covering size projections from 2025 to 2034. This report explores crucial market trends, major drivers and market segmentation by [key segment categories].
What Is the Expected Condyloma Acuminata Treatment Market Size During the Forecast Period?
In the past few years, the condyloma acuminata treatment market has seen significant growth. The market value, which is anticipated to…
Household Type Fans Market Forecast 2025-2034: Comprehensive Analysis And Growth …
"The Household Type Fans Market Report by The Business Research Company delivers a detailed market assessment, covering size projections from 2025 to 2034. This report explores crucial market trends, major drivers and market segmentation by [key segment categories].
What Is the Projected Growth of the Household Type Fans Market?
The market size for household fans has seen consistent expansion in recent years. The projections indicate an increase from $32.22 billion in 2024…
Grain Fumigants Industry Report 2025-2034: Market Dynamics, Trends, And Forecast …
The Grain Fumigants Market Report by The Business Research Company delivers a detailed market assessment, covering size projections from 2025 to 2034. This report explores crucial market trends, major drivers and market segmentation by [key segment categories].
What Is the Expected Grain Fumigants Market Size During the Forecast Period?
The Grain Fumigants Market Report by The Business Research Company delivers a detailed market assessment, covering size projections from 2025 to 2034. This…
More Releases for Packaging
Personalized Packaging Market 2019 By Key Players: Owens Illinois, Salazar Packa …
Personalized Packaging Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period.
Download PDF Sample of this Report @
http://www.supplydemandmarketresearch.com/home/contact/277379?ref=Sample-and-Brochure&toccode=SDMRCH277379&utm_source=S2
The following manufacturers are covered:
Owens Illinois
Salazar Packaging
Design Packaging
PrimeLine Packaging
International Packaging
Elegant Packaging
Pak Factory
ABOX Packaging
ACG Ecopak
CB Group
SoOPAK Company
Huhtamaki…
E-Commerce Packaging Market by Top Key Players - Pioneer Packaging, Arihant pack …
E-commerce packaging involves the use of materials for safe packaging of products sold by the e-commerce industry. E-commerce packaging plays a vital role in the consumers' perception about the e-retailer. It also indicates the perceived value of the item received. Packaging reflects the value of shipment in the e-commerce supply chain, that is, better the packaging, better the product inside it.
Get Sample Copy of this Report @ https://www.bigmarketresearch.com/request-sample/2904563
The E-Commerce…
Luxury Packaging Market 2019 SWOT Analysis By Top Key Players; MW Luxury Packagi …
Luxury Packaging Market report provides an in-depth overview of product specification, technology, product type and production analysis considering major factors such as revenue, cost, gross and gross margin. The company profiles of all the key players and brands that are dominating the Luxury Packaging Market with moves like product launches, joint ventures, merges and accusations which in turn is affecting the sales, import, export, revenue and CAGR values are mentioned…
Global Luxury Packaging Market 2019 Top Key Players: MW Luxury Packaging, Progre …
Summary
WiseGuyReports.com adds “Luxury Packaging Market 2019 Global Analysis, Growth, Trends and Opportunities Research Report Forecasting to 2024” reports to its database.
This report provides in depth study of “Luxury Packaging Market” using SWOT analysis i.e. Strength, Weakness, Opportunities and Threat to the organization. The Luxury Packaging Market report also provides an in-depth survey of key players in the market which is based on the various objectives of an organization such as…
Top Manufacturer in Luxury Packaging Market 2019: MW Luxury Packaging, Progress …
Luxury packaging is used for packaging and decorating high-end products.An increase in the luxury product consumption rate and the number of product launches in the fashion and cosmetic sectors are some major factors driving the market growth.
The global Luxury Packaging market is valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025. The objectives…
Personalized Packaging Market 2025 | Design Packaging, Inc., PrimeLine Packaging …
As per the new market report published by Research Report Insights titled ‘Personalized Packaging Market’: Global Industry Analysis and Forecast 2017-2025’, global personalized packaging market attained a value worth US$ 25,577.9 Mn in 2017 and will possibly thrive at a promising CAGR of 5.1% over the forecast period (2017-2025). The global personalized packaging market has witnessed solid growth during the past few decades, owing to the increasing trend of luxury…
