Rising Demand for High-End Packaging Solutions will Fuel the Global Semiconductor Assembly and Testing Services Market

The global semiconductor assembly & testing services (SATS) market is expected to reach a CAGR of 4.7% in a forecast period from 2015 to 2021. The market will witness an annual growth of US$ 39,050.7 Mn by the end of 2021.

The industry of semiconductors is volatile in nature and the companies that are key market players focus on influencing designing resources and utilizing its skill in augmenting the performance of ICs. Thus, outsourcing maximum amount of packaging, testing, and semiconductor assembly services to third party providers by fabless companies is called Outsourced Semiconductor Assembly and Test Services (OSATS) Providers.

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Moreover, rising construction cost of state-of-the-art wafer fabrication outlet has shifted the processing technology of semiconductors from small size to larger wafers. Semiconductor companies are focusing on their core business rather to remaining fabless due to high capital expenditure in wafer fabrication and its packaging as well as testing operations. Thus, high demand for outsourced SATS services by SATS providers is expected during the forecast period.

Currently, the main drivers of SATS market worldwide include growing demand for connected devices worldwide and connectivity as well as mobility in consumer electronic products. These factors are also fueling the demand for setting up potential revenue opportunity and advanced packaging technologies. Another prime reason for growth of semiconductor assembly & testing services market is the additional features proffered by Semiconductor Assembly & Testing Services providers. Also, Semiconductor Assembly & Testing Services providers expedite more effective supply chain and so lessens time interval to market for a product, therefore providers of SATS are the prime option for manufacturers of integrated design. In the automobile industry, more usage of safety systems is also contributing to the market growth of Semiconductor Assembly & Testing Services.

However, factors including fluctuations in exchange rates, high capital required for high end packaging solutions, and market volatility is anticipated to restrain the market growth of Semiconductor Assembly & Testing Services.

The segmentation of semiconductor assembly & testing services market is done on the basis of services, application and region. In terms of services, the SATS market is further classified into testing and assembly & packaging services. Among these, the segment of assembly & packaging services is estimated to account for 79.4% market share in 2015 and will rise at a CAGR of 4.9% during the forecast period from 2015 to 2021.

Based on application, the SATS market is further classified into consumer electronics, communications, automotive electronics, computing & networking, and industrial. In terms of region, during the forecast period, Taiwan region of the SATS market is expected to signify largest market share by 2021, registering a CAGR of 5.8%.

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The key players in the market of semiconductor assembly & testing services are Amkor technology Inc., ASE group, Siliconware Precision Industries Co., Ltd (SPIL) and STATS ChipPAC Ltd.

Long-term Outlook: The global semiconductor assembly & testing services market is expected to reach a CAGR of 4.7% in a forecast period from 2015 to 2021.

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Summary: Global Market of Semiconductor Assembly and Testing Services. Rising Demand for High-End Packaging Solutions.

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