ED Copper Foil for PCB Market Size, Share, Trends, and Forecast: 2024-2030

QY Research Inc. (Global Market Report Research Publisher) announces the release of 2024 latest report "ED Copper Foil for PCB- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030". Based on current situation and impact historical analysis (2019-2023) and forecast calculations (2024-2030), this report provides a comprehensive analysis of the global Wire Drawing Dies market, including market size, share, demand, industry development status, and forecasts for the next few years.
 
The global ED Copper Foil for PCB market is projected to grow from US$ 6134 million in 2024 to US$ 9642 million by 2030, at a Compound Annual Growth Rate (CAGR) of 7.8% during the forecast period.
 
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 Copper foil is a foil form of copper less than the thickness of 150µm and there are two types, a rolled copper foil and an electrolytic copper foil. Normally and a rolled copper foil is made by rolling and annealing electrolytic copper continuously and there is a restriction of the length. In contrast, an electrolytic copper foil has no restriction of the length. Copper Foils are mostly used for printed circuit boards, flexible printed circuit boards, and lithium-ion batteries.

Electrolytic copper foil is a specialized type of copper material created for use in printed circuit boards (PCBs). It is produced through an electrochemical deposition process, where copper is plated from a solution onto a rotating drum to create ultra-thin, uniform sheets. This process results in a high-quality copper foil with excellent conductivity, uniform thickness, and strong adhesion properties, making it ideal for electronics applications.

The global ED Copper Foil for PCB market was valued at US$ 5.66 billion in 2023 and is anticipated to reach US$ 9.64 billion by 2030, witnessing a CAGR of 7.83% during the forecast period 2024-2030.
 The major global manufacturers of ED Copper Foil for PCB include Kingboard, CCP, Mitsui Mining & Smelting, Anhui Tongguan Copper Foil, Nan Ya Plastics Corporation, Jiangxi JCC Copper Foil, Co-Tech, and J Shandong Jinbao Electronic, etc. in 2023, the world's top three vendors accounted for 36.63% of the revenue.

Asia-Pacific accounted for the largest sales share of the ED Copper Foil for PCB market in 2023. Asia-Pacific market for ED Copper Foil for PCB is estimated to increase from 411.05 k tons in 2024 to reach 641.88 k tons by 2030, at a CAGR of 6.29% during the forecast period of 2024 through 2030.

The global expansion of data centers and cloud computing facilities requires high-performance PCBs that offer reliability, speed, and effective heat dissipation, boosting the demand for high-quality copper foil. Due to the complexity of data center equipment, the demand for ED copper foil in high-speed, high-density PCBs continues to rise, especially for cooling and energy management.

As semiconductor packaging advances (such as chip-scale and fan-out packaging), PCBs require ultra-thin, high-purity copper foil to achieve precise connectivity and conductivity. Copper foil manufacturers are developing specialized copper foils for semiconductor applications, which increases the market share of ultra-thin, high-precision copper foil.

The extensive use of AI and HPC technologies increases the demand for specialized PCBs that support high computing power and high-speed data transfer, where high-quality copper foil ensures conductivity and stability. AI and HPC drive the need for advanced ED copper foil with ultra-low resistance and high heat resistance to support complex data processing and storage devices.

The acceleration of Industry 4.0 and smart manufacturing demands high-performance PCBs for industrial control and automation, where stability and conductivity are essential. The medical industry's growing demand for portable diagnostics, monitoring equipment, and implantable electronics requires miniaturized, highly reliable PCBs.

 
 
The report provides a detailed analysis of the market size, growth potential, and key trends for each segment. Through detailed analysis, industry players can identify profit opportunities, develop strategies for specific customer segments, and allocate resources effectively.
 
The ED Copper Foil for PCB market is segmented as below:
By Company
    Kingboard
    CCP
    Mitsui Mining & Smelting
    Anhui Tongguan Copper Foil
    Nan Ya Plastics Corporation
    Jiangxi JCC Copper Foil
    Co-Tech
    Shandong Jinbao Electronic
    Jiujiang Defu
    Solus Advanced Materials
    Yihao New Materials
    Hubei Zhongyi Technology
    Londian Wason Energy Tech
    LCY Technology
    Mingfeng Electronics
    Furukawa Electric
    Chaohua Technology
    Fukuda
    Jiayuan Technology
 
Segment by Type
    General Copper Foil
    High-end Copper Foil
 
Segment by Application
    AI Accelerator
    Data Centers
    Semiconductor
    5G
    Others
 
Each chapter of the report provides detailed information for readers to further understand the ED Copper Foil for PCB market:
Chapter 1: Introduces the report scope of the ED Copper Foil for PCB report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. (2019-2030)
Chapter 2: Detailed analysis of ED Copper Foil for PCB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc. (2019-2024)
Chapter 3: Provides the analysis of various ED Copper Foil for PCB market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. (2019-2030)
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.(2019-2030)
Chapter 5:  Sales, revenue of ED Copper Foil for PCB in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world..(2019-2030)
Chapter 6:  Sales, revenue of ED Copper Foil for PCB in country level. It provides sigmate data by Type, and by Application for each country/region.(2019-2030)
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc. (2019-2024)
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
 
Benefits of purchasing QYResearch report:
Competitive Analysis: QYResearch provides in-depth ED Copper Foil for PCB competitive analysis, including information on key company profiles, new entrants, acquisitions, mergers, large market shear, opportunities, and challenges. These analyses provide clients with a comprehensive understanding of market conditions and competitive dynamics, enabling them to develop effective market strategies and maintain their competitive edge.
Industry Analysis: QYResearch provides ED Copper Foil for PCB comprehensive industry data and trend analysis, including raw material analysis, market application analysis, product type analysis, market demand analysis, market supply analysis, downstream market analysis, and supply chain analysis.
and trend analysis. These analyses help clients understand the direction of industry development and make informed business decisions.
Market Size: QYResearch provides ED Copper Foil for PCB market size analysis, including capacity, production, sales, production value, price, cost, and profit analysis. This data helps clients understand market size and development potential, and is an important reference for business development.
 
Other relevant reports of QYResearch:
Global and China ED Copper Foil for PCB Market Report & Forecast 2024-2030
ED Copper Foil for PCB- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Global ED Copper Foil for PCB Market Research Report 2024
 
 

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