Lucintel Forecasts High-Density Interconnect (HDI) PCB Market to Reach $20.8 Billion by 2030

According to the recent study the High-Density Interconnect (HDI) PCB Market is projected to reach an estimated $20.8 Billion by 2030 from $15.2 billion in 2023, at a CAGR of 4.8% from 2024 to 2030. Growth in this market is primarily driven by increasing demand for miniaturization of electronic devices, growing technological advancement, and rising demand from 5G and IoT.
According to the recent study the High-Density Interconnect (HDI) PCB Market [https://www.lucintel.com/high-density-interconnect-printed-circuit-board-market.aspx] is projected to reach an estimated $20.8 Billion by 2030 from $15.2 billion in 2023, at a CAGR of 4.8% from 2024 to 2030. Growth in this market is primarily driven by increasing demand for miniaturization of electronic devices, growing technological advancement, and rising demand from 5G and IoT.

Browse 99 figures / charts and 76 tables in this 199 -page report to understand trends, opportunities and forecast in high-density interconnect (HDI) PCB market by end use industry (smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive, and others), technology (4-6 layer, 8-10 layer, and 10+ layer), build-up structure (1+n+1, 2+n+2, 3+n+3, and others), and region (North America, Europe, APAC and the Rest of the World).

Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphones and telecommunication equipment. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.

- Smartphones will remain the largest end use industry due to the increasing demand for high performance PCB and growing demand for more space in smartphones for larger batteries. Automotive is expected to witness the highest growth over the forecast period due to advancement in automotive electronics.

Download sample by clicking on High-Density Interconnect (HDI) PCB Market

Asia Pacific will remain the largest market, and it is also expected to witness the highest growth over the forecast period due to the increasing electronic content in automotive and growth in consumer electronic devices & telecommunication products.

TTM Technologies, Inc., Tripod Technology Corporation, AT&S, Kingboard Holdings Ltd., CCTC, DG Shengyi Electronics, Dynamic Electronics Co. Ltd., Gold Circuit Electronics, Olympic, DAP, Unimicron Technology Corp.,Compeq Manufacturing Co., Ltd., Ibiden Co., Ltd., Zhen Ding Technology Holding Limited, Unitech, Samsung Electro-Mechanics, and Meiko Electronics Co. Ltd. are the major supplier in the high-density interconnect (HDI) PCB market.

This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or write us at helpdesk@lucintel.com

About Lucintel

At Lucintel, we offer solutions for you growth through game changer ideas and robust market & unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times.

Contact: Roy Almaguer Lucintel Dallas, Texas, USA Email: roy.almaguer@lucintel.com Tel. +1 972.636.5056

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