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Power Module Packaging Market Growing at 9.7% CAGR by 2033 - User demand is Driving Growth

11-11-2024 01:51 PM CET | Business, Economy, Finances, Banking & Insurance

Press release from: Emergen Research

Power Module Packaging Market

Power Module Packaging Market

The global power module packaging market size was USD 1.68 billion in 2022 and is expected to register a steady revenue CAGR of 9.7 % during the forecast period, according to latest analysis by Emergen Research. Rapid demand for power module packaging technology in autonomous vehicles and Electric Vehicles (EVs) is a key factor driving market revenue growth. A power electronic module acts as a physical container for storage of several power components, usually power semiconductor devices. Globally, several Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) Original Equipment Manufacturers (OEMs) players are incorporating Silicon Carbide (SiC) and Gallium Nitride (GaN)-based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. In addition, advancement in Si. Gallium Nitride (GaN)-based innovative power electronic components for high-voltage applications, such as charging and e-drivetrain, is another key factor driving revenue growth of the market.

The latest report, titled 'Global Power Module Packaging Market,' comprises a profound analysis of the fundamental parameters contributing to the global Power Module Packaging market scenario. The research report provides the reader with an in-depth interpretation of the Power Module Packaging market dynamics, including the crucial drivers, opportunities, threats, and challenges. The report also describes the key business strategies, demand and supply ratios, leading regions, and the renowned market players, in a nutshell, offering a futuristic outlook of the overall Power Module Packaging industry. The market intelligence report is a prototype of the 360° overview of the global Power Module Packaging industry, shedding light on the estimated market value, share, growth trends, gross revenue, competitive overview, prominent manufacturers and buyers, available product types, and end-use applications.

To Receive A PDF Sample Of The Report, Visit @https://www.emergenresearch.com/request-sample/2356

Competitive Terrain:

The global Power Module Packaging industry is highly consolidated owing to the presence of renowned companies operating across several international and local segments of the market. These players dominate the industry in terms of their strong geographical reach and a large number of production facilities. The companies are intensely competitive against one another and excel in their individual technological capabilities, as well as product development, innovation, and product pricing strategies.

The Leading Market Contenders Listed In The Report Are:

SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc

Some Key Highlights From the Report

The standard packaging segment is expected to account for largest revenue share in the global power module packaging market over the forecast period due to increasing requirement for automotive electrification technology. These standardized power modules play a crucial role in EVs and Hybrid Electric Vehicles (HEVs). In addition, EV Original Equipment Manufacturers (EV OEMs) are actively seeking cost-effective solutions for Direct Current (DC) to Alternate Current (AC) traction inverters. Standardized power module packaging has emerged as a prominent solution to address the evolving market demands related to EV traction technology.

The hybrid segment is expected to register steadily fast revenue growth rate in the global power module packaging market over the forecast period. This is because hybrid cooling thermal types involve the integration of both liquid cooling and air-cooling systems. This hybrid approach is designed to optimize the heat dissipation capacity of power modules. Consequently, this technology is expected to find applications in various high-voltage power insulation in the future.

The North America market accounted for largest revenue share in the global power module packaging market in 2022 due to rising adoption of Electric Vehicles (EVs) in North America. The U.S., stands out as a significant contributor to the widespread adoption of Silicon Carbide (SiC) and Gallium Nitride (GaN) power module packaging within the EV and autonomous vehicle sectors. Furthermore, increasing government support and investments in manufacturing semiconductors is also expected to drive market revenue growth during the forecast period. For example, in August 2022, The CHIPS and Science Act of the U.S. allocated USD 52.7 billion to support American semiconductor manufacturing and Research & Development (R&D).

To Get A Discount On The Latest Report, Visit @https://www.emergenresearch.com/request-discount/2356

For the purpose of this report, Emergen Research has segmented the global power module packaging market on the basis of power module type, technology, thermal type, end-use, and region:

Power Module Type Outlook (Revenue, USD Billion; 2019-2032)

Silicon Carbide (SiC)) Module

Gallium Nitride (GaN) Module

Insulated-Gate Bipolar Transistor (IGBT) Module

Field-Effect Transistor (FET) Module

Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module

Others

Technology Outlook (Revenue, USD Billion; 2019-2032)

Standard Packaging

Advanced Packaging

Pressure-Contact Modules

Others

Thermal Type Outlook (Revenue, USD Billion; 2019-2032)

Liquid-Cooled

Air-Cooled

Hybrid

End-use Outlook (Revenue, USD Billion; 2019-2032)

Manufacturing

Automotive

Consumer Electronics

Telecommunications

Aerospace and Defense

Renewable Energy

Others

Regional Segmentation:

North America

Latin America

Europe

Middle East & Africa

Asia Pacific

Browse Detailed Research Report @https://www.emergenresearch.com/industry-report/power-module-packaging-market

Report Highlights:

Besides offering a vivid depiction of the global Power Module Packaging business sphere and its fundamental operations, the latest report provides the industrial chain analysis and list down the current and future market trends and growth opportunities.

The report includes information on the present and historical market scenarios, which helps forecast the market conditions over the next eight years (2020-2027).

The report scrutinizes the salient factors influencing the growth of the market in the near future.

The strategic marketing recommendations, crucial information related to the new market entrants, and expansion plans of various businesses are poised to provide the reader with a competitive edge in the market.

Key Benefits of the Report:

Comprehensive analysis of the competitive scenario and its changing dynamics

Analytical data with detailed SWOT analysis and Porter's Five Forces analysis

In-depth 8 year analysis of the Global Power Module Packaging Market

Critical assessment of the key market segments

Comprehensive analysis of the drivers, restraints, trends, and opportunities

Detailed regional analysis and extensive company profiling

Extensive assessment of current and emerging trends of the market

Buy Now: @https://www.emergenresearch.com/select-license/2356

Browse More Report By Emergen Research:

Power Module Packaging Market Size @ https://www.emergenresearch.com/industry-report/power-module-packaging-market/market-size

Power Module Packaging Market Share @ https://www.emergenresearch.com/industry-report/power-module-packaging-market/market-share

Power Module Packaging Market Trends @ https://www.emergenresearch.com/industry-report/power-module-packaging-market/market-trends

Power Module Packaging Regional Market Demand @ https://www.emergenresearch.com/industry-report/power-module-packaging-market/regional-market-demand

Power Module Packaging Market Analysis @ https://www.emergenresearch.com/industry-report/power-module-packaging-market/market-analysis

Contact Us:
Eric Lee
Corporate Sales Specialist
Emergen Research | Web: www.emergenresearch.com
Direct Line: +1 (604) 757-9756
E-mail: sales@emergenresearch.com
Visit for More Insights: https://www.emergenresearch.com/insights

Emergen Research is a market research and consulting company that provides syndicated research reports, customized research reports, and consulting services. Our solutions purely focus on your purpose to locate, target, and analyse consumer behavior shifts across demographics, across industries, and help clients make smarter business decisions. We offer market intelligence studies ensuring relevant and fact-based research across multiple industries, including Healthcare, Touch Points, Chemicals, Types, and Energy. We consistently update our research offerings to ensure our clients are aware of the latest trends existent in the market. Emergen Research has a strong base of experienced analysts from varied areas of expertise. Our industry experience and ability to develop a concrete solution to any research problems provides our clients with the ability to secure an edge over their respective competitors.

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