Press release
Semiconductor Laser Debonding System Market: Size, Share, Growth, Analysis, Key Players, Revenue, | Valuates Reports
Semiconductor Laser Debonding System MarketThe semiconductor laser debonding system is a process equipment used for debonding semiconductor devices. It uses high-energy laser beams to melt or cut the bonding wires to realize the debonding operation of the device.
According to new survey, global Semiconductor Laser Debonding System market is projected to reach US$ million in 2030, increasing from US$ million in 2023, with the CAGR of % during the period of 2024 to 2030.
Semiconductor laser debonding systems usually include: laser source, optical system, motion control system, control unit, display/operation interface. It has the characteristics of non-contact, high precision, and no damage, and can realize debonding of micro-sized and high-density packaged devices.
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Report Scope
This report, based on historical analysis (2019-2023) and forecast calculation (2024-2030), aims to help readers to get a comprehensive understanding of global Semiconductor Laser Debonding System market with multiple angles, which provides sufficient supports to readers' strategy and decision making.
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Segment by Type
• Semi-Automatic
• Fully Automatic
Segment by Application
• Wafer Material
• Optical Component
• Others
By Company
SUSS MicroTec Group, EV Group, Shin-Etsu, Samcien, Han'S Laser, Suzhou Cowin, Shenzhen Shengfang, Baoding Zhongchuang, Chengdu Laipu, Suzhou Wisee Tec
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