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Wafer Back-Grinding Machine Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports
Wafer Back-Grinding Machine MarketThe global Wafer Back-Grinding Machine market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
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According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Wafer Back-Grinding Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Back-Grinding Machine.
The report will help the Wafer Back-Grinding Machine manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Type
• Wafer Edge Grinding Machine
• Wafer Surface Grinding Machine
By Application
• Silicon Wafer
• SiC Wafer
• Sapphire Wafer
Key Companies
Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, Daitron, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam
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